Taiwan semiconductor manufacturing company, ltd. (20240339511). SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND BACKSIDE SELF-ALIGNED VIA simplified abstract

SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND BACKSIDE SELF-ALIGNED VIA

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Kuo-Cheng Chiang of Hsinchu County (TW)

Shi Ning Ju of Hsinchu City (TW)

Kuan-Lun Cheng of Hsin-Chu (TW)

Chih-Hao Wang of Hsinchu County (TW)

Cheng-Chi Chuang of New Taipei City (TW)

SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND BACKSIDE SELF-ALIGNED VIA - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240339511 titled 'SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND BACKSIDE SELF-ALIGNED VIA

The semiconductor structure described in the patent application includes a source/drain, one or more channel layers, a gate structure, a first silicide layer, a source/drain contact, a power rail, first dielectric layers, and second dielectric layers enclosing an air gap.

• The source/drain is connected to the channel layers, with a gate structure adjacent to them.
• A first silicide layer is positioned over the source/drain, with a source/drain contact on top.
• A power rail is located under the source/drain for power distribution.
• First dielectric layers separate the source/drain from the power rail.
• Second dielectric layers under the first silicide layer and on the sidewalls of the source/drain enclose an air gap.

Potential Applications: - This semiconductor structure can be used in the manufacturing of advanced electronic devices such as high-performance transistors. - It can also be applied in the development of integrated circuits for various electronic applications.

Problems Solved: - Provides improved performance and efficiency in electronic devices. - Enhances the overall functionality and reliability of semiconductor components.

Benefits: - Increased speed and efficiency in electronic devices. - Enhanced durability and longevity of semiconductor structures. - Improved power distribution and thermal management.

Commercial Applications: - This technology can be utilized in the production of high-speed processors, memory chips, and other advanced electronic components. - It has potential applications in the telecommunications, computing, and consumer electronics industries.

Questions about the Semiconductor Structure: 1. How does the air gap enclosed by the second dielectric layers contribute to the performance of the semiconductor structure? 2. What are the specific advantages of having a power rail under the source/drain in this semiconductor design?

Original Abstract Submitted

a semiconductor structure includes a source/drain; one or more channel layers connected to the source/drain; a gate structure adjacent the source/drain and engaging each of the one or more channel layers; a first silicide layer over the source/drain; a source/drain contact over the first silicide layer; a power rail under the source/drain; one or more first dielectric layers between the source/drain and the power rail; and one or more second dielectric layers under the first silicide layer and on sidewalls of the source/drain, wherein the one or more second dielectric layers enclose an air gap.