Taiwan semiconductor manufacturing company, ltd. (20240339448). NOVEL THIN FILM RESISTOR simplified abstract
Contents
NOVEL THIN FILM RESISTOR
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hung-Chih Yu of Hsinchu City (TW)
Chien-Mao Chen of Zhubei City (TW)
NOVEL THIN FILM RESISTOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339448 titled 'NOVEL THIN FILM RESISTOR
The abstract of the patent application describes a semiconductor device with a metal thin film on a semiconductor substrate, along with first and second contact structures spaced apart by a dummy layer containing a polishing resistance material.
- Simplified Explanation:
The patent application discusses a semiconductor device that has a metal thin film on a semiconductor substrate, with contact structures separated by a dummy layer containing a polishing resistance material.
- Key Features and Innovation:
- Metal thin film on semiconductor substrate - Contact structures separated by dummy layer - Dummy layer contains polishing resistance material
- Potential Applications:
- Semiconductor manufacturing - Electronics industry - Integrated circuits
- Problems Solved:
- Improved polishing resistance - Enhanced device performance - Better contact structure design
- Benefits:
- Increased device reliability - Enhanced manufacturing process - Improved overall performance
- Commercial Applications:
- Semiconductor fabrication companies - Electronics manufacturers - Research institutions
- Prior Art:
- Prior research on semiconductor device structures - Previous patents related to contact structures in semiconductor devices
- Frequently Updated Research:
- Ongoing developments in semiconductor device technology - Latest advancements in contact structure design
Questions about semiconductor devices: 1. How does the dummy layer with a polishing resistance material improve the performance of the semiconductor device? 2. What are the potential commercial applications of this technology in the electronics industry?
Original Abstract Submitted
a semiconductor device includes: a metal thin film disposed on a semiconductor substrate; and first and second contact structures disposed on the metal thin film, wherein the first and second contact structures are laterally spaced from each other by a dummy layer that comprises at least one polishing resistance material.
