Taiwan semiconductor manufacturing company, ltd. (20240339422). SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION simplified abstract
Contents
SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Che Wei Yang of New Taipei City (TW)
Kuo-Ming Wu of Zhubei City (TW)
Sheng-Chau Chen of Tainan City (TW)
Cheng-Yuan Tsai of Chu-Pei City (TW)
Hau-Yi Hsiao of Chiayi City (TW)
SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339422 titled 'SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION
The patent application describes techniques for forming a stacked die product with multiple integrated circuit dies, focusing on the bond interface between the dies to reduce warpage.
- The bond interface between integrated circuit dies in a stacked die product has a layered structure.
- The layered structure includes sealant material layers directly on the co-facing surfaces of the two integrated circuit dies.
- One or more bonding layers are present between the sealant material layers on the co-facing surfaces.
- The layered structure aims to reduce lateral stresses throughout the bond interface, decreasing the likelihood of warpage in the integrated circuit dies.
Potential Applications: - Semiconductor manufacturing - Electronics industry - Microchip production
Problems Solved: - Warpage in integrated circuit dies - Lateral stresses in bond interfaces
Benefits: - Improved reliability of stacked die products - Enhanced performance of integrated circuits - Cost-effective manufacturing process
Commercial Applications: Title: Advanced Stacked Die Products for Semiconductor Industry This technology can be utilized in the production of high-performance electronic devices, such as smartphones, tablets, and computers, to enhance their functionality and durability in a cost-effective manner.
Questions about Stacked Die Products: 1. How does the layered structure in the bond interface help reduce warpage in integrated circuit dies? The layered structure with sealant material and bonding layers minimizes lateral stresses, thereby decreasing the likelihood of warpage in the integrated circuit dies.
2. What are the potential applications of this technology beyond semiconductor manufacturing? This technology can also be applied in the aerospace industry for the production of advanced electronic systems in satellites and spacecraft, where reliability and performance are crucial.
Original Abstract Submitted
some implementations described herein provide techniques and apparatuses for forming a stacked die product including two or more integrated circuit dies. a bond interface between two integrated circuit dies that are included in the stacked die product includes a layered structure. as part of the layered structure, respective layers of a sealant material are directly on co-facing surfaces of the two integrated circuit dies. the layered structure further includes one or more bonding layers between the respective layers of the sealant material that are directly on the co-facing surfaces of the two integrated circuit dies. the layered structure may reduce lateral stresses throughout the bond interface to reduce a likelihood of warpage of the two integrated circuit dies.
