Taiwan semiconductor manufacturing company, ltd. (20240337800). PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING WAVEGUIDE simplified abstract
Contents
PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING WAVEGUIDE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hsing-Kuo Hsia of Jhubei City (TW)
PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING WAVEGUIDE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240337800 titled 'PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING WAVEGUIDE
The semiconductor package described in the abstract consists of a first interposer with a first substrate, a first redistribution structure, and a first waveguide. Additionally, a photonic package is attached to the first side of the first interposer, containing an electronic die and a photonic die with multiple dielectric layers and a second waveguide.
- The semiconductor package includes a first interposer with a first substrate, a first redistribution structure, and a first waveguide.
- A photonic package is attached to the first side of the first interposer, containing an electronic die and a photonic die with multiple dielectric layers and a second waveguide.
- The first redistribution structure is positioned between the first substrate and the first waveguide.
- The second waveguide in the photonic die is proximate to the second side of the photonic die.
- The photonic die is attached to the first side of the first interposer, with the second waveguide in one of the dielectric layers.
Potential Applications: - Advanced semiconductor packaging technology for high-speed data transmission. - Integration of electronic and photonic components for improved performance in communication systems.
Problems Solved: - Enhanced signal transmission efficiency. - Integration of electronic and photonic functionalities in a compact package.
Benefits: - Improved data processing speed and efficiency. - Compact design for space-saving in electronic devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for High-Speed Data Transmission This technology can be utilized in telecommunications equipment, data centers, and high-performance computing systems for faster and more efficient data transmission.
Questions about the technology: 1. How does the integration of electronic and photonic components improve data transmission efficiency? 2. What are the potential challenges in implementing this advanced semiconductor packaging technology in commercial applications?
Original Abstract Submitted
a semiconductor package includes a first interposer having a first substrate, a first redistribution structure over a first side of the first substrate, and a first waveguide over the first redistribution structure and proximate to a first side of the first interposer, where the first redistribution structure is between the first substrate and the first waveguide. the semiconductor package further includes a photonic package attached to the first side of the first interposer, where the photonic package includes: an electronic die, and a photonic die having a plurality of dielectric layers and a second waveguide in one of the plurality of dielectric layers, where a first side of the photonic die is attached to the electronic die, and an opposing second side of the photonic die is attached to the first side of the first interposer, where the second waveguide is proximate to the second side of the photonic die.
