Taiwan semiconductor manufacturing company, ltd. (20240321814). SEMICONDUCTOR STRUCTURE simplified abstract

SEMICONDUCTOR STRUCTURE

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Hsien-Wei Chen of Hsinchu City (TW)

Ming-Fa Chen of Taichung City (TW)

SEMICONDUCTOR STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240321814 titled 'SEMICONDUCTOR STRUCTURE

The abstract describes a semiconductor structure with two semiconductor dies, where the first die has a bonding structure that includes a first dielectric layer, a second dielectric layer, and embedded first conductors. The second die is bonded to the first die's bonding structure, with the first conductors making contact with the second dielectric layer.

• The semiconductor structure includes two semiconductor dies with a unique bonding structure.
• The first die's bonding structure consists of a first dielectric layer, a second dielectric layer, and embedded first conductors.
• The second die is bonded to the first die's bonding structure, with the first conductors in contact with the second dielectric layer.
• Each first conductor comprises a first conductive barrier layer and a first conductive pillar.
• The innovation allows for efficient bonding between semiconductor dies while maintaining electrical connectivity.

Potential Applications: This technology can be applied in semiconductor manufacturing, integrated circuits, and electronic devices requiring multiple semiconductor dies.

Problems Solved: This technology addresses the challenge of bonding multiple semiconductor dies while ensuring proper electrical connectivity and reliability.

Benefits: Enhanced bonding reliability, improved electrical connectivity, increased efficiency in semiconductor manufacturing processes.

Commercial Applications: Title: Advanced Semiconductor Bonding Structure for Enhanced Connectivity This technology can be utilized in the production of high-performance electronic devices, integrated circuits, and semiconductor components, potentially impacting industries such as telecommunications, consumer electronics, and automotive electronics.

Questions about the technology: 1. How does this semiconductor structure improve the reliability of bonding between dies? 2. What are the potential cost-saving implications of using this advanced bonding structure in semiconductor manufacturing processes?

Frequently Updated Research: Researchers are continually exploring new materials and techniques to further enhance the performance and reliability of semiconductor bonding structures. Stay updated on the latest advancements in semiconductor manufacturing processes for improved electronic devices.

Original Abstract Submitted

a semiconductor structure including a first semiconductor die and a second semiconductor die is provided. the first semiconductor die includes a first bonding structure. the second semiconductor die is bonded to the first bonding structure of the first semiconductor die. the first bonding structure includes a first dielectric layer, a second dielectric layer covering the first dielectric layer, and first conductors embedded in the first dielectric layer and the second dielectric layer, wherein each of the first conductors includes a first conductive barrier layer covering the first dielectric layer and a first conductive pillar disposed on the first conductive barrier layer, and the first conductive pillars are in contact with the second dielectric layer.