Taiwan semiconductor manufacturing company, ltd. (20240304561). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Sen-Kuei Hsu of Kaohsiung City (TW)
Chien-Chang Lin of New Taipei City (TW)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240304561 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application includes a semiconductor die, a stack of polymer layers, redistribution elements, and a passive filter. The polymer layers cover the front surface of the semiconductor die, while the redistribution elements and the passive filter are located within the stack of polymer layers. The passive filter consists of a ground plane and conductive patches, with the ground plane overlapping the conductive patches and the patches being laterally separated from each other. The ground plane is connected to a reference voltage, while the conductive patches are either connected to the ground plane, floated electrically, or linked to a direct current (DC) voltage.
- The semiconductor package features a unique passive filter design with a ground plane and conductive patches.
- The conductive patches are electrically connected to the ground plane, floated electrically, or coupled to a DC voltage.
- The polymer layers provide protection and insulation for the semiconductor die.
- The redistribution elements facilitate the routing of signals within the package.
- The passive filter helps in reducing electromagnetic interference and improving signal integrity.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and laptops. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Minimization of electromagnetic interference. - Enhancement of signal integrity. - Protection of the semiconductor die.
Benefits: - Improved performance and reliability of electronic devices. - Reduction in signal distortion. - Enhanced overall functionality of the semiconductor package.
Commercial Applications: Title: Innovative Passive Filter Technology for Enhanced Signal Integrity This technology can be utilized in the consumer electronics industry to improve the performance of electronic devices and enhance user experience. It can also find applications in the automotive sector for improving the efficiency of electronic systems in vehicles.
Questions about Semiconductor Package Technology: 1. How does the passive filter in the semiconductor package contribute to reducing electromagnetic interference? 2. What are the potential benefits of using a ground plane and conductive patches in the passive filter design?
Original Abstract Submitted
a semiconductor package is provided. the semiconductor package includes a semiconductor die, a stack of polymer layers, redistribution elements and a passive filter. the polymer layers cover a front surface of the semiconductor die. the redistribution elements and the passive filter are disposed in the stack of polymer layers. the passive filter includes a ground plane and conductive patches. the ground plane is overlapped with the conductive patches, and the conductive patches are laterally separated from one another. the ground plane is electrically coupled to a reference voltage. the conductive patches are electrically connected to the ground plane, electrically floated, or electrically coupled to a direct current (dc) voltage.
