Taiwan semiconductor manufacturing company, ltd. (20240304551). ALUMINUM STRUCTURES simplified abstract
Contents
ALUMINUM STRUCTURES
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
ALUMINUM STRUCTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240304551 titled 'ALUMINUM STRUCTURES
Simplified Explanation: The patent application describes devices with aluminum structures and methods of fabrication. An exemplary device includes an interconnect structure and an aluminum structure electrically connected to the interconnect structure. The aluminum structure consists of a first aluminum layer, a migration barrier layer over the first aluminum layer, and a second aluminum layer over the migration barrier layer.
Key Features and Innovation:
- Devices with aluminum structures
- Method of fabrication
- Interconnect structure
- First aluminum layer
- Migration barrier layer
- Second aluminum layer
Potential Applications: The technology can be applied in various electronic devices, such as smartphones, tablets, laptops, and other consumer electronics. It can also be used in industrial equipment and automotive components.
Problems Solved: The technology addresses issues related to electrical connections in devices, such as improving conductivity, preventing migration of aluminum atoms, and enhancing the overall performance and reliability of the devices.
Benefits:
- Improved conductivity
- Enhanced performance
- Increased reliability
- Longer lifespan of devices
- Cost-effective fabrication process
Commercial Applications: The technology can be utilized in the manufacturing of electronic devices, industrial machinery, automotive components, and other products that require efficient electrical connections and high-performance materials.
Questions about Aluminum Structures: 1. How does the migration barrier layer in the aluminum structure prevent the migration of aluminum atoms? 2. What are the specific advantages of using aluminum structures in electronic devices compared to other materials?
Frequently Updated Research: Researchers are continuously exploring new methods to enhance the properties of aluminum structures, improve fabrication techniques, and optimize the performance of devices incorporating such structures. Stay updated on the latest advancements in this field for potential future applications and innovations.
Original Abstract Submitted
devices with aluminum structures and methods of fabrication are provided. an exemplary device includes an interconnect structure and an aluminum structure electrically connected to the interconnect structure. the aluminum structure includes a first aluminum layer, a migration barrier layer over the first aluminum layer, and a second aluminum layer over the migration barrier layer.
