Taiwan semiconductor manufacturing company, ltd. (20240304544). INTEGRATED CIRCUIT STRUCTURE simplified abstract

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INTEGRATED CIRCUIT STRUCTURE

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Te-Hsin Chiu of Miaoli County (TW)

Shih-Wei Peng of Hsinchu City (TW)

Wei-Cheng Lin of Taichung City (TW)

Jiann-Tyng Tzeng of Hsinchu City (TW)

INTEGRATED CIRCUIT STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240304544 titled 'INTEGRATED CIRCUIT STRUCTURE

The abstract describes an integrated circuit structure with a gate, a first conductive line, a pair of second conductive lines, and a first feed-through via. The gate is on the front side of the structure, while the first conductive line and second conductive lines are on the back side. The first feed-through via connects the gate to the first conductive line.

  • Gate, first conductive line, pair of second conductive lines, and first feed-through via in integrated circuit structure
  • Gate on front side, extending in first direction on first side of dielectric layer
  • First conductive line and pair of second conductive lines on back side of dielectric layer
  • First conductive line positioned between pair of second conductive lines
  • First feed-through via extends through dielectric layer in second direction, connecting gate to first conductive line

Potential Applications: - Semiconductor industry for integrated circuits - Electronics manufacturing for improved circuit design

Problems Solved: - Efficient signal transmission between components - Enhanced performance and reliability of integrated circuits

Benefits: - Improved connectivity and signal integrity - Compact layout design for space-saving solutions

Commercial Applications: - Semiconductor companies for developing advanced integrated circuits - Electronics manufacturers for high-performance electronic devices

Questions about Integrated Circuit Structure: 1. How does the first feed-through via enhance the performance of the integrated circuit structure? 2. What are the key advantages of positioning the first conductive line between the pair of second conductive lines?


Original Abstract Submitted

an integrated circuit structure is provided, including a gate, a first conductive line and a pair of second conductive lines, and a first feed-through via. the gate is disposed on a front side of the integrated circuit structure and extends in a first direction on a first side of a dielectric layer. the first conductive line and a pair of second conductive lines are disposed on a second side, opposite of the first side, of the dielectric layer and on a back side, opposite of the front side, of the integrated circuit structure. the first conductive line is interposed between the pair of second conductive lines in a layout view. the first feed-through via extends through the dielectric layer in a second direction different from the first direction. the first feed-through via couples the gate to the first conductive line.