Taiwan semiconductor manufacturing company, ltd. (20240302410). PROBE HEAD STRUCTURE simplified abstract
Contents
PROBE HEAD STRUCTURE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Wen-Yi Lin of New Taipei City (TW)
Hao Chen of New Taipei City (TW)
Chuan-Hsiang Sun of Taoyuan City (TW)
Chen-Shien Chen of Zhubei City, Hsinchu County (TW)
PROBE HEAD STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240302410 titled 'PROBE HEAD STRUCTURE
The abstract of the patent application describes a probe head structure that includes a flexible substrate with a probe pillar passing through it, a redistribution structure, a wiring substrate, and a conductive bump.
- The probe head structure features a flexible substrate with a probe pillar passing through it.
- A redistribution structure is located on the top surface of the flexible substrate and the probe pillar.
- A wiring substrate is positioned over the redistribution structure.
- A first conductive bump connects the wiring substrate and the redistribution structure.
Potential Applications: - This technology could be used in the development of advanced electronic testing equipment. - It may find applications in medical devices for precise measurements and diagnostics.
Problems Solved: - Provides a stable and reliable connection between different components of the probe head structure. - Enhances the overall performance and accuracy of electronic testing equipment.
Benefits: - Improved functionality and durability of probe head structures. - Enhanced precision and reliability in electronic testing processes.
Commercial Applications: Title: Advanced Probe Head Structures for Electronic Testing Equipment This technology could be utilized in the manufacturing of electronic testing equipment for various industries, including semiconductor, medical, and research.
Questions about the technology: 1. How does the probe head structure improve the performance of electronic testing equipment? 2. What are the potential challenges in implementing this technology in different applications?
Original Abstract Submitted
a probe head structure is provided. the probe head structure includes a flexible substrate having a top surface and a bottom surface. the probe head structure includes a first probe pillar passing through the flexible substrate. the probe head structure includes a redistribution structure on the top surface of the flexible substrate and the first probe pillar. the probe head structure includes a wiring substrate over the redistribution structure. the probe head structure includes a first conductive bump connected between the wiring substrate and the redistribution structure.
