Taiwan semiconductor manufacturing company, ltd. (20240297137). SEMICONDUCTOR DIE simplified abstract
Contents
SEMICONDUCTOR DIE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Yen-Kun Lai of New Taipei City (TW)
Chien-Hao Hsu of Hsinchu County (TW)
Wei-Hsiang Tu of Hsinchu City (TW)
Kuo-Chin Chang of Chiayi City (TW)
Mirng-ji Lii of Hsinchu County (TW)
SEMICONDUCTOR DIE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240297137 titled 'SEMICONDUCTOR DIE
Simplified Explanation:
This patent application describes a semiconductor die with a complex interconnect structure and a conductive bump. The interconnect structure consists of stacked layers with embedded wiring, including vias, while the conductive bump is placed on top of this structure.
Key Features and Innovation:
- Semiconductor die with a sophisticated interconnect structure
- Stacked interconnect layers with embedded wiring and vias
- Conductive bump on top of the interconnect structure
Potential Applications: This technology could be used in various semiconductor devices where precise interconnects are required, such as microprocessors, memory chips, and sensors.
Problems Solved: This technology addresses the need for efficient and reliable interconnects in semiconductor devices, improving overall performance and functionality.
Benefits:
- Enhanced electrical connectivity
- Improved signal transmission
- Higher reliability and durability
Commercial Applications: Potential commercial applications include the semiconductor industry for the production of advanced electronic devices with high-performance interconnects.
Prior Art: Researchers interested in this technology may want to explore prior patents related to semiconductor interconnect structures and conductive bump designs.
Frequently Updated Research: Researchers in the field of semiconductor technology may be conducting ongoing studies on advanced interconnect structures and conductive bump materials for improved performance and reliability.
Questions about Semiconductor Die Technology: 1. What are the key components of a semiconductor die? 2. How does the interconnect structure impact the overall performance of a semiconductor device?
Original Abstract Submitted
a semiconductor die includes a semiconductor substrate, an interconnect structure, and a conductive bump. the interconnect structure is disposed on and electrically connected to the semiconductor substrate. the interconnect structure includes stacked interconnect layers. each of the stacked interconnect layers includes a dielectric layer and an interconnect wiring embedded in the dielectric layer. the interconnect wiring of a first interconnect layer among the stacked interconnect layers further includes a first via and second vias. the first via electrically connected to the interconnect wiring. the second vias connected to the interconnect wiring, and the first via and the second vias are located on a same level height. the conductive bump is disposed on the interconnect structure. the conductive bump includes a base portion and a protruding portion connected to the base portion, and the base portion is between the protruding portion and the first via.
