Taiwan semiconductor manufacturing company, ltd. (20240290734). PACKAGE STRUCTURE simplified abstract

PACKAGE STRUCTURE

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Chih-Hsuan Tai of Taipei City (TW)

Ting-Ting Kuo of Hsinchu City (TW)

Yu-Chih Huang of Hsinchu City (TW)

Chih-Wei Lin of Hsinchu County (TW)

Hsiu-Jen Lin of Hsinchu County (TW)

Chih-Hua Chen of Hsinchu County (TW)

Ming-Da Cheng of Taoyuan City (TW)

Ching-Hua Hsieh of Hsinchu City (TW)

Hao-Yi Tsai of Hsinchu City (TW)

Chung-Shi Liu of Hsinchu City (TW)

PACKAGE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240290734 titled 'PACKAGE STRUCTURE

The abstract of the patent application describes a package structure that includes a semiconductor device, a molding compound, a first dielectric layer, and a through-via. The molding compound is in contact with a sidewall of the semiconductor device, the first dielectric layer is over the molding compound and the semiconductor device, and the through-via is in the molding compound and the first dielectric layer. The through-via is a continuous element and is in contact with the first dielectric layer.

• The package structure includes a semiconductor device, molding compound, first dielectric layer, and through-via.
• The molding compound is in contact with the semiconductor device's sidewall.
• The first dielectric layer is positioned over the molding compound and the semiconductor device.
• The through-via is a continuous element that is in contact with the first dielectric layer.

Potential Applications: - This technology could be used in the manufacturing of integrated circuits and electronic devices. - It may find applications in the telecommunications and automotive industries for improved electronic component packaging.

Problems Solved: - Provides a reliable and efficient package structure for semiconductor devices. - Enhances the performance and durability of electronic components.

Benefits: - Improved reliability and performance of semiconductor devices. - Enhanced packaging efficiency and durability. - Potential cost savings in the manufacturing process.

Commercial Applications: Title: Advanced Package Structure for Semiconductor Devices This technology could be utilized in the production of various electronic devices, including smartphones, computers, and automotive electronics. It offers a more robust and efficient packaging solution for semiconductor devices, leading to improved product performance and reliability in the market.

Questions about the technology: 1. How does the through-via contribute to the overall performance of the package structure? 2. What are the potential cost-saving benefits for manufacturers using this advanced package structure?

Original Abstract Submitted

a package structure includes a semiconductor device, a molding compound, a first dielectric layer, and a through-via. the molding compound is in contact with a sidewall of the semiconductor device. the first dielectric layer is over the molding compound and the semiconductor device. the through-via is in the molding compound and the first dielectric layer. the through-via is a continuous element and in contact with the first dielectric layer.