Taiwan semiconductor manufacturing company, ltd. (20240282653). PACKAGE STRUCTURE simplified abstract
Contents
- 1 PACKAGE STRUCTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGE STRUCTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Semiconductor Packaging Technology
- 1.13 Original Abstract Submitted
PACKAGE STRUCTURE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hung-Jui Kuo of Hsinchu City (TW)
Tai-Min Chang of Taipei City (TW)
PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282653 titled 'PACKAGE STRUCTURE
Simplified Explanation
The patent application describes a package structure consisting of a first die and an encapsulant. The first die includes a substrate, pads, passivation layer, first die connectors, and a dielectric layer. The encapsulant surrounds the first die, with one of the connectors being taper-shaped.
- The package structure includes a first die and an encapsulant.
- The first die has various components such as pads, passivation layer, first die connectors, and a dielectric layer.
- The encapsulant surrounds the first die.
- One of the first die connectors is taper-shaped, with its width increasing gradually from top to bottom.
Key Features and Innovation
- Package structure with a first die and encapsulant.
- Taper-shaped die connector with gradually increasing width.
- Dielectric layer for lateral encapsulation.
- Passivation layer on pads for protection.
Potential Applications
This technology can be used in semiconductor packaging, integrated circuits, and electronic devices where compact and efficient packaging is required.
Problems Solved
- Provides protection and insulation for the first die connectors.
- Ensures secure encapsulation of the first die.
- Facilitates efficient packaging of electronic components.
Benefits
- Enhanced protection for delicate components.
- Improved reliability and durability of electronic devices.
- Compact and efficient packaging design.
Commercial Applications
Title: Advanced Semiconductor Packaging Technology for Enhanced Device Reliability This technology can be applied in the manufacturing of smartphones, tablets, laptops, and other consumer electronics to improve the performance and longevity of electronic devices.
Prior Art
Further research can be conducted in the field of semiconductor packaging, dielectric materials, and connector design to explore existing technologies related to this innovation.
Frequently Updated Research
Researchers are constantly exploring new materials and techniques for semiconductor packaging to enhance the performance and reliability of electronic devices.
Questions about Semiconductor Packaging Technology
What are the key components of a semiconductor package structure?
A semiconductor package structure typically includes a die, pads, connectors, passivation layer, and encapsulant to protect and connect electronic components.
How does the taper-shaped die connector improve the packaging design?
The taper-shaped die connector allows for a gradual increase in width, providing better contact and insulation for the electronic components within the package structure.
Original Abstract Submitted
provided is a package structure including a first die and an encapsulant. the first die includes a substrate, a plurality of pads over the substrate, a passivation layer on portions of each of the plurality of pads, a plurality of first die connectors on the plurality of pads, respectively and a dielectric layer laterally encapsulating the plurality of first die connectors. the encapsulant laterally encapsulates the first die. one of the plurality of first die connectors is a taper-shaped die connector. a width of the one of the plurality of first die connectors gradually increases from a top surface of the one of the plurality of first die connectors toward the a top surface of the passivation layer.
