Taiwan semiconductor manufacturing company, ltd. (20240266303). CHIPLET INTERPOSER simplified abstract

CHIPLET INTERPOSER

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Shang-Yun Hou of Jubei (TW)

Weiming Chris Chen of Hsinchu (TW)

Kuo-Chiang Ting of Hsinchu (TW)

Hsien-Pin Hu of Zhubei (TW)

Wen-Chih Chiou of Zhunan Township (TW)

Chen-Hua Yu of Hsinchu (TW)

CHIPLET INTERPOSER - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240266303 titled 'CHIPLET INTERPOSER

The patent application describes packages and methods for forming packages with interposers made of dielectric material and redistribution structures with metallization patterns stitched together in a patterning process involving multiple lateral overlapping patterning exposures.

• Interposers with dielectric substrates
• Redistribution structures with metallization patterns
• Patterning process with multiple lateral overlapping exposures

Potential Applications: - Advanced semiconductor packaging - High-performance electronic devices - Miniaturized electronic components

Problems Solved: - Improved signal integrity - Enhanced thermal management - Increased packaging density

Benefits: - Higher performance capabilities - Enhanced reliability - Cost-effective manufacturing processes

Commercial Applications: Title: Advanced Semiconductor Packaging Solutions This technology can be utilized in the production of high-performance electronic devices, leading to improved functionality and reliability in various industries such as telecommunications, automotive, and consumer electronics.

Questions about the technology: 1. How does the use of dielectric substrates in interposers benefit the overall performance of electronic devices? - Dielectric substrates in interposers help improve signal integrity and thermal management, leading to enhanced overall performance.

2. What are the key advantages of using redistribution structures with metallization patterns in packaging processes? - Redistribution structures with metallization patterns allow for increased packaging density and cost-effective manufacturing processes.

Original Abstract Submitted

embodiments include packages and methods for forming packages which include interposers having a substrate made of a dielectric material. the interposers may also include a redistribution structure over the substrate which includes metallization patterns which are stitched together in a patterning process which includes multiple lateral overlapping patterning exposures.