Taiwan semiconductor manufacturing company, ltd. (20240258095). PARTICLE REMOVAL APPARATUS simplified abstract
Contents
PARTICLE REMOVAL APPARATUS
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Siao-Chian Huang of Hsinchu (TW)
Po-Chung Cheng of Zhongpu Shiang (TW)
Ching-Juinn Huang of Pushin Shiang (TW)
Tzung-Chi Fu of Miaoli City (TW)
Tsung-Yen Lee of Jhudong Township (TW)
PARTICLE REMOVAL APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240258095 titled 'PARTICLE REMOVAL APPARATUS
The patent application describes a particle removal apparatus consisting of a reticle holder, a robotic arm, and a particle removal device.
- The robotic arm and particle removal device are designed to target and remove particles on the backside of a reticle.
- The particle removal device includes a solution spraying module, a sucking module, and a baffle to effectively remove particles.
- The solution spraying module sprays a solution onto the particle for removal.
- The baffle creates an enclosed area around the particle to be removed.
- The sucking module then removes the solution along with the particles from the reticle.
Potential Applications: - Semiconductor manufacturing - Optics industry - Microelectronics production
Problems Solved: - Efficient removal of particles on delicate surfaces - Precision cleaning in manufacturing processes
Benefits: - Improved product quality - Increased productivity - Cost-effective solution for particle removal
Commercial Applications: Title: Advanced Particle Removal Apparatus for Precision Cleaning in Manufacturing This technology can be utilized in industries such as semiconductor manufacturing, optics, and microelectronics for precise and efficient particle removal, leading to higher quality products and increased productivity.
Questions about the technology: 1. How does the apparatus ensure precise removal of particles without damaging the surface? 2. What are the potential cost savings for manufacturers using this particle removal technology?
Original Abstract Submitted
a particle removal apparatus is provided. the apparatus includes a reticle holder configured to hold a reticle, a robotic arm, and a particle removal device disposed on the robotic arm. the particle removal device includes a solution spraying module, a sucking module, and a baffle. the robotic arm and the particle removal device are configured to align with a particle on the backside of the reticle. the solution spraying module is configured to spray a solution onto the particle to remove the particle. the baffle is configured to be disposed over the backside of the reticle to define enclosed area that encompasses the particle to be removed. the sucking module is configured to suck the solution on the reticle with the particles being removed.
