Taiwan semiconductor manufacturing company, ltd. (20240213237). INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS simplified abstract
Contents
INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Fong-Yuan Chang of Hsinchu (TW)
Po-Hsiang Huang of Tainan City (TW)
Jyh Chwen Frank Lee of Palo Alto CA (US)
INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213237 titled 'INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
The abstract describes a method of forming a semiconductor device, involving the use of a carrier, thermal dissipation block, metal posts, integrated circuit die, semiconductor package, electrical connectors, and external electrical connectors.
- Forming a first interconnect structure over a carrier
- Forming a thermal dissipation block over the carrier
- Forming metal posts over the first interconnect structure
- Attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block
- Removing the carrier
- Attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors
- Forming external electrical connectors to transmit each external electrical connection into the semiconductor device, with the thermal dissipation block being electrically isolated from each external electrical connection.
Potential Applications: - Semiconductor manufacturing - Electronics industry - Thermal management systems
Problems Solved: - Efficient thermal dissipation - Secure attachment of integrated circuit die - Electrical connectivity in semiconductor devices
Benefits: - Improved performance and reliability - Enhanced thermal management - Streamlined manufacturing process
Commercial Applications: Title: Semiconductor Device Manufacturing: Innovations in Thermal Dissipation This technology can be applied in various industries such as consumer electronics, automotive, telecommunications, and aerospace for improved semiconductor device performance and reliability.
Questions about Semiconductor Device Manufacturing: 1. How does the use of a thermal dissipation block improve the overall performance of the semiconductor device? - The thermal dissipation block helps dissipate heat generated by the integrated circuit die, preventing overheating and ensuring optimal performance. 2. What are the key advantages of using metal posts in the semiconductor device assembly process? - Metal posts provide structural support and electrical connectivity, enhancing the overall stability and functionality of the device.
Original Abstract Submitted
a method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.
