Taiwan semiconductor manufacturing company, ltd. (20240213186). INTEGRATED FAN-OUT PACKAGE simplified abstract
Contents
INTEGRATED FAN-OUT PACKAGE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chuei-Tang Wang of Taichung City (TW)
Tzu-Chun Tang of Kaohsiung City (TW)
Chieh-Yen Chen of Taipei City (TW)
Che-Wei Hsu of Kaohsiung City (TW)
INTEGRATED FAN-OUT PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213186 titled 'INTEGRATED FAN-OUT PACKAGE
The integrated fan-out (info) package described in the abstract consists of a die, an encapsulant, and a horn antenna. The die has an active surface and a rear surface, while the encapsulant laterally encapsulates the die. The horn antenna is electrically connected to the die and includes a top wall and a bottom wall located on two opposite sides of the die and the encapsulant.
- The package includes a die with an active surface and a rear surface, encapsulated laterally by an encapsulant.
- A horn antenna is electrically connected to the die, with a top wall and a bottom wall on opposite sides of the die and encapsulant.
Potential Applications: This technology could be used in wireless communication devices, radar systems, and other applications requiring compact and efficient antenna integration.
Problems Solved: The integrated fan-out package solves the problem of integrating a horn antenna with a die in a compact and effective manner.
Benefits: The package offers a compact solution for integrating a horn antenna with a die, improving the overall performance and efficiency of the system.
Commercial Applications: This technology could be valuable in the development of small, high-performance communication devices for various industries, including telecommunications and aerospace.
Questions about the Integrated Fan-Out Package: 1. How does the horn antenna improve the performance of the die in the integrated fan-out package?
The horn antenna enhances the communication capabilities of the die by providing efficient signal transmission and reception.
2. What are the potential challenges in manufacturing and implementing the integrated fan-out package in commercial devices?
The main challenges may include ensuring precise alignment of the components and optimizing the design for mass production.
Original Abstract Submitted
an integrated fan-out (info) package includes a die, an encapsulant, and a horn antenna. the die has an active surface and a rear surface opposite to the active surface. the encapsulant laterally encapsulates the die. the horn antenna is electrically connected to the die. the horn antenna includes a top wall and a bottom wall respectively located on two opposite sides of the die and the encapsulant.
