Taiwan semiconductor manufacturing company, ltd. (20240213016). Method of Forming Conductive Feature Including Cleaning Step simplified abstract
Contents
Method of Forming Conductive Feature Including Cleaning Step
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Cheng-Wei Chang of Taipei City (TW)
Min-Hsiu Hung of Tainan City (TW)
Method of Forming Conductive Feature Including Cleaning Step - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213016 titled 'Method of Forming Conductive Feature Including Cleaning Step
- Simplified Explanation:**
The patent application describes a method for forming a semiconductor device by creating a conductive feature in an opening through a dielectric layer, treating seeds on the sidewalls of the opening, removing the treated seeds, and filling the opening with a second conductive feature.
- Key Features and Innovation:**
- Formation of a first conductive feature on the bottom surface of an opening
- Treatment of seeds on the sidewalls to form treated seeds
- Removal of treated seeds with a cleaning process
- Formation of a second conductive feature to fill the opening
- Potential Applications:**
This technology can be applied in the semiconductor industry for the manufacturing of advanced semiconductor devices.
- Problems Solved:**
This method addresses the challenge of forming precise and reliable conductive features in semiconductor devices.
- Benefits:**
- Improved accuracy and reliability in forming conductive features
- Enhanced performance of semiconductor devices
- Streamlined manufacturing process
- Commercial Applications:**
The technology can be utilized in the production of various semiconductor devices, leading to increased efficiency and performance in electronic devices.
- Questions about Semiconductor Device Formation:**
1. How does the treatment process improve the formation of conductive features in semiconductor devices? 2. What are the advantages of using this method in semiconductor manufacturing processes?
- Frequently Updated Research:**
Researchers are constantly exploring new materials and techniques to further enhance the performance and efficiency of semiconductor devices. Stay updated on the latest advancements in the field to leverage the most cutting-edge technologies.
Original Abstract Submitted
a method of forming a semiconductor device includes forming a first conductive feature on a bottom surface of an opening through a dielectric layer. the forming the first conductive feature leaves seeds on sidewalls of the opening. a treatment process is performed on the seeds to form treated seeds. the treated seeds are removed with a cleaning process. the cleaning process may include a rinse with deionized water. a second conductive feature is formed to fill the opening.
