Taiwan semiconductor manufacturing company, ltd. (20240210636). PACKAGE STRUCTURE simplified abstract

PACKAGE STRUCTURE

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Chung-Ming Weng of Hsinchu (TW)

Chen-Hua Yu of Hsinchu City (TW)

Chung-Shi Liu of Hsinchu City (TW)

Hao-Yi Tsai of Hsinchu City (TW)

Cheng-Chieh Hsieh of Tainan (TW)

Hung-Yi Kuo of Taipei City (TW)

Tsung-Yuan Yu of Taipei City (TW)

Hua-Kuei Lin of Hsinchu city (TW)

Che-Hsiang Hsu of Hsinchu (TW)

PACKAGE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240210636 titled 'PACKAGE STRUCTURE

The patent application describes a package structure that includes a photonic die, an electronic die, an encapsulant, and a waveguide. The photonic die features an optical coupler, while the electronic die is electrically connected to the photonic die. The encapsulant surrounds both the photonic and electronic dies, and a waveguide is positioned over the encapsulant with an upper surface facing away from it. The waveguide has a first end portion optically coupled to the optical coupler and a second end portion with a groove on the upper surface.

• Photonic die with optical coupler
• Electronic die electrically coupled to photonic die
• Encapsulant surrounding both dies
• Waveguide positioned over encapsulant with upper surface facing away
• Waveguide has first end portion optically coupled to optical coupler and second end portion with groove

Potential Applications: - Optical communication systems - Integrated photonics devices - Data transmission technologies

Problems Solved: - Efficient optical and electronic coupling - Enhanced signal transmission - Improved packaging and protection of dies

Benefits: - Increased data transfer speeds - Compact and reliable package structure - Enhanced performance of photonic and electronic components

Commercial Applications: Title: Advanced Integrated Photonic-Electronic Package for High-Speed Data Transmission This technology can be utilized in telecommunications, data centers, and high-speed computing applications. It offers a competitive advantage in terms of speed, efficiency, and reliability in data transmission systems.

Prior Art: Researchers can explore prior patents related to integrated photonics, electronic packaging, and waveguide technologies to understand the existing knowledge in this field.

Frequently Updated Research: Researchers are continuously exploring advancements in integrated photonics, electronic packaging, and waveguide technologies to further improve data transmission speeds and efficiency.

Questions about the Technology: 1. How does the integration of photonic and electronic components improve data transmission efficiency? 2. What are the key challenges in developing advanced integrated photonic-electronic packages for high-speed applications?

Original Abstract Submitted

a package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. the photonic die includes an optical coupler. the electronic die is electrically coupled to the photonic die. the encapsulant laterally encapsulates the photonic die and the electronic die. the waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. the waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.