Taiwan semiconductor manufacturing company, ltd. (20240204104). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Wan-Yi Kao of Baoshan Township (TW)

Yu-Cheng Shiau of Hsinchu (TW)

Chunyao Wang of Zhubei City (TW)

Chih-Tang Peng of Zhubei City (TW)

Yung-Cheng Lu of Hsinchu (TW)

Chi On Chui of Hsinchu (TW)

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240204104 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Simplified Explanation:

This patent application describes a method for manufacturing a semiconductor device by depositing liners made of different materials in a recess between two semiconductor fins and annealing them to transform the materials.

• A first liner made of a first material is deposited to line the recess.
• The first liner is annealed to change the material to a second material.
• A second liner made of a third material is then deposited to line the recess.
• The second liner is annealed to transform the material to a fourth material.

Key Features and Innovation:

• Method for lining a recess between semiconductor fins with different materials.
• Annealing process to transform materials for improved performance.
• Utilization of multiple liners with varying materials for enhanced semiconductor device construction.

Potential Applications:

This technology can be applied in the manufacturing of various semiconductor devices such as transistors, diodes, and integrated circuits.

Problems Solved:

This method addresses the need for precise and efficient lining of recesses in semiconductor devices to improve their performance and reliability.

Benefits:

• Enhanced performance and reliability of semiconductor devices.
• Improved manufacturing process efficiency.
• Potential for increased functionality in semiconductor applications.

Commercial Applications:

The technology can be utilized in the production of advanced electronic devices, leading to improved performance and functionality in consumer electronics, telecommunications, and computing industries.

Prior Art:

Readers can explore prior research on semiconductor device manufacturing methods, materials science, and semiconductor device design to gain a deeper understanding of the innovation presented in this patent application.

Frequently Updated Research:

Researchers in the field of semiconductor device manufacturing and materials science may provide updates on the development and application of similar methods in the industry.

Questions about Semiconductor Device Manufacturing: 1. How does the use of different materials in the liners impact the performance of the semiconductor device? 2. What are the potential challenges in scaling up this manufacturing method for mass production?

Original Abstract Submitted

a semiconductor device and method of manufacture are provided. in embodiments a first liner is deposited to line a recess between a first semiconductor fin and a second semiconductor fin, the first liner comprising a first material. the first liner is annealed to transform the first material to a second material. a second liner is deposited to line the recess, the second liner comprising a third material. the second liner is annealed to transform the third material to a fourth material.