Taiwan semiconductor manufacturing company, ltd. (20240203947). PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hsien-Wei Chen of Hsinchu City (TW)
Jie Chen of New Taipei City (TW)
Ming-Fa Chen of Taichung City (TW)
PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203947 titled 'PACKAGE AND MANUFACTURING METHOD THEREOF
Simplified Explanation: The patent application describes a package containing two dies with capacitors, where the second die is stacked on top of the first die and encapsulated laterally.
Key Features and Innovation:
- Package includes a first die with a first capacitor and a second die with a second capacitor.
- Second die is stacked on top of the first die.
- First capacitor is spatially separated from the second capacitor but electrically connected.
- Encapsulant laterally encapsulates the second die.
Potential Applications: This technology could be used in electronic devices requiring compact and efficient capacitor arrangements, such as mobile phones, tablets, and wearables.
Problems Solved: This technology solves the challenge of integrating multiple capacitors in a small space while maintaining electrical connections and physical separation.
Benefits:
- Compact design
- Efficient use of space
- Reliable electrical connections
Commercial Applications: Potential commercial applications include consumer electronics, medical devices, and automotive electronics where space-saving and efficient capacitor arrangements are crucial for performance.
Prior Art: Readers can start searching for prior art related to stacked die packaging and capacitor integration in electronic devices.
Frequently Updated Research: Stay updated on advancements in semiconductor packaging technologies and capacitor integration methods for electronic devices.
Questions about the Technology: 1. What are the specific advantages of having spatially separated but electrically connected capacitors in a stacked die package? 2. How does the lateral encapsulation of the second die contribute to the overall reliability and performance of the package?
Original Abstract Submitted
a package includes a first die, a second die, and an encapsulant. the first die includes a first capacitor. the second die includes a second capacitor. the second die is stacked on the first die. the first capacitor is spatially separated from the second capacitor. the first capacitor is electrically connected to the second capacitor. the encapsulant laterally encapsulates the second die.
