Taiwan semiconductor manufacturing company, ltd. (20240203936). SEMICONDUCTOR STRUCTURE simplified abstract

SEMICONDUCTOR STRUCTURE

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Mao-Yen Chang of Kaohsiung City (TW)

Yu-Chia Lai of Miaoli County (TW)

Cheng-Shiuan Wong of Hsinchu City (TW)

Ting Hao Kuo of Hsinchu City (TW)

Ching-Hua Hsieh of Hsinchu (TW)

Hao-Yi Tsai of Hsinchu City (TW)

Kuo-Lung Pan of Hsinchu city (TW)

Hsiu-Jen Lin of Hsinchu County (TW)

SEMICONDUCTOR STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240203936 titled 'SEMICONDUCTOR STRUCTURE

The semiconductor structure described in the patent application consists of a functional die, a dummy die, a conductive feature, a seal ring, and an alignment mark. The dummy die is isolated from the functional die, while the conductive feature is connected to the functional die. The seal ring is positioned next to the conductive feature, and the alignment mark is located between the seal ring and the conductive feature, being isolated from the dummy die, the conductive feature, and the seal ring.

• The semiconductor structure includes a functional die, a dummy die, a conductive feature, a seal ring, and an alignment mark.
• The dummy die is electrically isolated from the functional die.
• The conductive feature is electrically connected to the functional die.
• The seal ring is placed beside the conductive feature.
• The alignment mark is situated between the seal ring and the conductive feature, being electrically isolated from the dummy die, the conductive feature, and the seal ring.

Potential Applications: - Semiconductor manufacturing - Integrated circuit design - Electronics industry

Problems Solved: - Ensuring electrical isolation between components - Facilitating alignment during manufacturing processes

Benefits: - Improved functionality and reliability of semiconductor structures - Enhanced manufacturing efficiency - Simplified alignment processes

Commercial Applications: Title: "Innovative Semiconductor Structure for Enhanced Manufacturing Efficiency" This technology can be utilized in the semiconductor industry to improve the production process of integrated circuits, leading to cost savings and increased productivity.

Prior Art: Researchers can explore prior patents related to semiconductor structures, alignment techniques, and electrical isolation methods in the field of semiconductor manufacturing.

Frequently Updated Research: Researchers can stay updated on advancements in semiconductor manufacturing techniques, alignment technologies, and materials used in the industry.

Questions about Semiconductor Structures: 1. How does the alignment mark contribute to the overall functionality of the semiconductor structure? 2. What are the potential challenges in implementing this technology in large-scale semiconductor manufacturing processes?

Original Abstract Submitted

a semiconductor structure includes a functional die, a dummy die, a conductive feature, a seal ring and an alignment mark. the dummy die is electrically isolated from the functional die. the conductive feature is electrically connected to the functional die. the seal ring is disposed aside the conductive feature. the alignment mark is disposed between the seal ring and the conductive feature, and the alignment mark is electrically isolated from the dummy die, the conductive feature and the seal ring.