Taiwan semiconductor manufacturing company, ltd. (20240203918). CHIP STACK STRUCTURE WITH CONDUCTIVE PLUG AND METHOD FOR FORMING THE SAME simplified abstract

CHIP STACK STRUCTURE WITH CONDUCTIVE PLUG AND METHOD FOR FORMING THE SAME

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Chuei-Tang Wang of Taichung City (TW)

Tso-Jung Chang of Taoyuan City (TW)

Shih-Ping Lin of Taichung City (TW)

Jeng-Shien Hsieh of Kaohsiung (TW)

Chih-Peng Lin of Hsinchu County (TW)

Chieh-Yen Chen of Taipei City (TW)

Chen-Hua Yu of Hsinchu City (TW)

CHIP STACK STRUCTURE WITH CONDUCTIVE PLUG AND METHOD FOR FORMING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240203918 titled 'CHIP STACK STRUCTURE WITH CONDUCTIVE PLUG AND METHOD FOR FORMING THE SAME

The abstract describes a chip stack structure consisting of multiple layers and interconnect structures.

• The first chip includes a substrate and interconnect structure.
• A second chip is bonded to the first chip, with its own interconnect structure and substrate.
• An insulating layer surrounds the second chip's substrate.
• A conductive plug penetrates through the insulating layer to the second interconnect structure.

Potential Applications: - This technology could be used in the development of advanced semiconductor devices. - It may find applications in the manufacturing of high-performance electronic components.

Problems Solved: - Provides a method for stacking chips efficiently while maintaining electrical connections. - Offers a solution for integrating multiple chips in a compact space.

Benefits: - Enables the creation of complex electronic systems in a smaller form factor. - Improves the performance and functionality of integrated circuits.

Commercial Applications: - This technology could be valuable in the production of smartphones, tablets, and other consumer electronics. - It may also have applications in the automotive industry for advanced driver assistance systems.

Questions about the Chip Stack Structure: 1. How does the conductive plug enhance the functionality of the chip stack structure? 2. What are the advantages of bonding multiple chips in a stack configuration?

Frequently Updated Research: - Stay updated on advancements in semiconductor manufacturing techniques that could impact the efficiency of chip stack structures.

Original Abstract Submitted

a chip stack structure is provided. the chip stack structure includes a first chip including a first substrate and a first interconnect structure over the first substrate. the chip stack structure includes a second chip over and bonded to the first chip. the second chip has a second interconnect structure and a second substrate over the second interconnect structure. the chip stack structure includes an insulating layer over the second interconnect structure and surrounding the second substrate. the chip stack structure includes a conductive plug penetrating through the insulating layer to the second interconnect structure.