Taiwan semiconductor manufacturing company, ltd. (20240203857). PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract
Contents
PACKAGE STRUCTURE WITH THROUGH VIAS
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Ling-Wei Li of Hsinchu city (TW)
Jung-Hua Chang of Hsinchu (TW)
Cheng-Lin Huang of Hsinchu City (TW)
PACKAGE STRUCTURE WITH THROUGH VIAS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203857 titled 'PACKAGE STRUCTURE WITH THROUGH VIAS
The abstract describes a package structure that includes a conductive structure with different sloped sidewalls, a semiconductor chip, and a protective layer made of a polymer material dispersed with fillers.
- The package structure has a unique design with sidewalls of different slopes.
- A semiconductor chip is positioned next to the conductive structure.
- A protective layer surrounds the conductive structure and the semiconductor chip.
- The protective layer is made of a polymer material with fillers dispersed in it.
- The design aims to provide enhanced protection and stability to the semiconductor chip.
Potential Applications: - This technology can be used in the manufacturing of electronic devices. - It can be applied in the production of advanced packaging solutions for semiconductor chips.
Problems Solved: - Provides improved protection for semiconductor chips. - Enhances the stability and durability of electronic devices.
Benefits: - Increased reliability of electronic devices. - Better performance and longevity of semiconductor chips.
Commercial Applications: Title: Advanced Packaging Solutions for Semiconductor Chips This technology can be utilized in the production of high-performance electronic devices, leading to improved market competitiveness and customer satisfaction.
Prior Art: Further research can be conducted in the field of semiconductor packaging technologies to explore similar innovations and advancements.
Frequently Updated Research: Stay updated on the latest developments in semiconductor packaging technologies to leverage new opportunities and advancements in the industry.
Questions about the technology: 1. How does the design of the package structure contribute to the protection of the semiconductor chip? 2. What are the potential cost implications of implementing this innovative packaging solution in electronic devices?
Original Abstract Submitted
a package structure is provided. the package structure includes a conductive structure having a first portion with a first sidewall and a second portion with a second sidewall, and the first sidewall and the second sidewall have different slopes. the package structure also includes a semiconductor chip beside the conductive structure and a protective layer laterally surrounding the conductive structure and the semiconductor chip. the protective layer covers the first sidewall of the first portion and the second sidewall of the second portion. the protective layer is made of a polymer material dispersed with fillers.
