Taiwan semiconductor manufacturing company, ltd. (20240201439). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about the Technology
- 1.13 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Feng-Wei Kuo of Hsinchu County (TW)
Wen-Shiang Liao of Miaoli County (TW)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240201439 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The semiconductor package described in the patent application includes a die stack with a photonic die and an electronic die stacked face-to-face. A convex lens on the electronic die helps collimate optical beams for better communication between photonic dies.
- The semiconductor package features a die stack with a photonic die and an electronic die.
- A convex lens on the electronic die helps collimate optical beams.
- The package may include multiple die stacks and an interposer for enhanced optical communication.
- Tilted reflectors in the photonic dies and interposer create vertical and lateral optical paths.
- The innovation enables efficient optical communication between photonic dies.
Key Features and Innovation
- Die stack with photonic and electronic dies.
- Convex lens for collimating optical beams.
- Multiple die stacks and interposer for enhanced communication.
- Tilted reflectors for vertical and lateral optical paths.
- Improved optical communication between photonic dies.
Potential Applications
The technology can be applied in:
- Data centers
- Telecommunications
- Optical networking
- High-speed computing
Problems Solved
- Enhances optical communication efficiency.
- Improves data transfer speeds.
- Facilitates high-speed computing applications.
Benefits
- Faster data transfer rates.
- Enhanced optical communication.
- Improved performance in data-intensive applications.
Commercial Applications
Title: Enhanced Optical Communication Semiconductor Package This technology can be utilized in data centers, telecommunications networks, and high-speed computing systems. It offers improved data transfer speeds and enhanced optical communication, making it ideal for applications requiring high-performance data processing.
Prior Art
Further research can be conducted in the field of semiconductor packaging, photonic integration, and optical communication technologies to explore related prior art.
Frequently Updated Research
Stay updated on advancements in semiconductor packaging, photonic integration, and optical communication technologies to leverage the latest innovations in the field.
Questions about the Technology
What are the potential commercial applications of this semiconductor package technology?
The technology can be applied in various industries such as data centers, telecommunications, and high-speed computing for improved data transfer speeds and enhanced optical communication.
How does the convex lens on the electronic die improve optical communication between photonic dies?
The convex lens helps collimate optical beams, ensuring better communication between photonic dies for efficient data transfer and processing.
Original Abstract Submitted
a semiconductor package and a manufacturing method thereof are provided. a die stack in the semiconductor package includes a photonic die and an electronic die stacked on the photonic die by a face-to-face manner. a convex lens is disposed at a back surface of the electronic die, and is formed in an oval shape, such that optical beams can be collimated to have circular beam shape, as passing through the convex lens. in some embodiments, the semiconductor package includes more of the die stacks, and includes an interposer lying below the die stacks. in these embodiments, tilted reflectors are formed in the photonic dies and the interposer, to set up vertical optical paths between the interposer and the photonic dies, and lateral optical paths in the interposer. in this way, optical communication between the photonic dies can be established.
