Taiwan semiconductor manufacturing company, ltd. (20240198455). DAMAGE PREVENTION DURING WAFER EDGE TRIMMING simplified abstract
Contents
DAMAGE PREVENTION DURING WAFER EDGE TRIMMING
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Kuo-Ming Wu of Zhubei City (TW)
Yung-Lung Lin of Taichung City (TW)
Hau-Yi Hsiao of Chiayi City (TW)
Sheng-Chau Chen of Tainan City (TW)
Cheng-Yuan Tsai of Chu-Pei City (TW)
DAMAGE PREVENTION DURING WAFER EDGE TRIMMING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240198455 titled 'DAMAGE PREVENTION DURING WAFER EDGE TRIMMING
The present disclosure describes a method for trimming an annular portion of a wafer using a rotating blade that changes speed based on a measured parameter.
- Wafer is aligned over a wafer chuck.
- Rotating blade with a first speed removes the annular portion from the wafer.
- Parameter of the wafer is measured near the blade.
- Blade speed changes to a second speed when the parameter exceeds a threshold.
Potential Applications: - Semiconductor manufacturing - Microelectronics industry - Wafer fabrication processes
Problems Solved: - Precise trimming of wafers - Consistent removal of annular portions - Efficient manufacturing processes
Benefits: - Improved accuracy in wafer trimming - Enhanced quality control - Increased productivity in production
Commercial Applications: Title: Advanced Wafer Trimming Technology for Semiconductor Industry This technology can be used in semiconductor fabrication facilities to streamline the wafer trimming process, leading to higher quality products and increased efficiency in production. The market implications include cost savings, improved yield rates, and competitive advantage in the industry.
Questions about Wafer Trimming Technology: 1. How does the method of changing blade speed based on a measured parameter improve wafer trimming accuracy? - By adjusting the blade speed in real-time, the method ensures precise removal of the annular portion, leading to consistent results and high-quality wafers.
2. What are the potential challenges in implementing this technology in semiconductor manufacturing facilities? - Some challenges may include integrating the system with existing equipment, optimizing the parameter measurement process, and training operators on the new method.
Original Abstract Submitted
in some embodiments, the present disclosure relates to a method of trimming an annular portion of a wafer. the method includes aligning the wafer over a wafer chuck. the method uses a rotating blade having a first rotational speed to remove the annular portion from an upper surface of the wafer. while the rotating blade is removing the annular portion of the upper surface of the wafer, measuring a parameter of the wafer at a position adjacent to the rotating blade. lastly, the method involves changing the first rotation speed of the rotating blade to a second rotational speed when the parameter is greater than a predetermined threshold.
