Taiwan semiconductor manufacturing company, ltd. (20240178263). DUAL FACING BSI IMAGE SENSORS WITH WAFER LEVEL STACKING simplified abstract
Contents
- 1 DUAL FACING BSI IMAGE SENSORS WITH WAFER LEVEL STACKING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DUAL FACING BSI IMAGE SENSORS WITH WAFER LEVEL STACKING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to traditional image sensor designs?
- 1.11 What are the manufacturing costs associated with implementing this technology?
- 1.12 Original Abstract Submitted
DUAL FACING BSI IMAGE SENSORS WITH WAFER LEVEL STACKING
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Ping-Yin Liu of Yonghe City (TW)
Chia-Shiung Tsai of Hsin-Chu (TW)
Pin-Nan Tseng of Hsin-Chu (TW)
DUAL FACING BSI IMAGE SENSORS WITH WAFER LEVEL STACKING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178263 titled 'DUAL FACING BSI IMAGE SENSORS WITH WAFER LEVEL STACKING
Simplified Explanation
The patent application describes a device with two backside-illuminated (BSI) image sensor elements and a third element bonded between them using element level stacking methods. Each BSI image sensor element includes a substrate with a metal stack on one side, and a photodiode region on the other side for accumulating an image charge in response to radiation. The metal stacks of the two BSI image sensor elements and the third element are electrically coupled.
- The device includes two BSI image sensor elements and a third element bonded between them.
- Each BSI image sensor element has a substrate with a metal stack and a photodiode region.
- The metal stacks of the elements are electrically coupled.
Potential Applications
The technology described in the patent application could be applied in:
- Digital cameras
- Smartphones
- Surveillance systems
Problems Solved
This technology helps in:
- Improving image sensor performance
- Enhancing image quality
- Increasing sensitivity to light
Benefits
The benefits of this technology include:
- Higher resolution images
- Improved low-light performance
- Enhanced overall image quality
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Consumer electronics
- Medical imaging devices
- Automotive cameras
Possible Prior Art
One possible prior art for this technology could be the use of stacked image sensor elements in digital cameras.
Unanswered Questions
How does this technology compare to traditional image sensor designs?
The article does not provide a direct comparison between this technology and traditional image sensor designs.
What are the manufacturing costs associated with implementing this technology?
The article does not address the specific manufacturing costs associated with implementing this technology.
Original Abstract Submitted
a device includes two bsi image sensor elements and a third element. the third element is bonded in between the two bsi image sensor elements using element level stacking methods. each of the bsi image sensor elements includes a substrate and a metal stack disposed over a first side of the substrate. the substrate of the bsi image sensor element includes a photodiode region for accumulating an image charge in response to radiation incident upon a second side of the substrate. the third element also includes a substrate and a metal stack disposed over a first side of the substrate. the metal stacks of the two bsi image sensor elements and the third element are electrically coupled.
