Taiwan semiconductor manufacturing company, ltd. (20240178214). LAYOUT DESIGNS OF INTEGRATED CIRCUITS HAVING BACKSIDE ROUTING TRACKS simplified abstract
Contents
- 1 LAYOUT DESIGNS OF INTEGRATED CIRCUITS HAVING BACKSIDE ROUTING TRACKS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LAYOUT DESIGNS OF INTEGRATED CIRCUITS HAVING BACKSIDE ROUTING TRACKS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology impact the overall size of the integrated circuit?
- 1.11 What are the potential limitations of this technology in terms of scalability to more complex circuits?
- 1.12 Original Abstract Submitted
LAYOUT DESIGNS OF INTEGRATED CIRCUITS HAVING BACKSIDE ROUTING TRACKS
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Jiann-Tyng Tzeng of Hsinchu (TW)
LAYOUT DESIGNS OF INTEGRATED CIRCUITS HAVING BACKSIDE ROUTING TRACKS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178214 titled 'LAYOUT DESIGNS OF INTEGRATED CIRCUITS HAVING BACKSIDE ROUTING TRACKS
Simplified Explanation
The integrated circuit described in the abstract includes a horizontal routing track in a first metal layer and a backside routing track in a backside metal layer. The horizontal routing track is connected to a first terminal of a first transistor, while the backside routing track is connected to a second terminal of the first transistor. One of the terminals is a gate terminal of the first transistor, while the other terminal is either a source or drain terminal.
- The integrated circuit includes a horizontal routing track in a first metal layer and a backside routing track in a backside metal layer.
- The horizontal routing track is conductively connected to a first terminal of a first transistor.
- The backside routing track is conductively connected to a second terminal of the first transistor.
- One terminal of the first transistor is a gate terminal, while the other terminal is either a source or drain terminal.
Potential Applications
This technology could be applied in the development of advanced integrated circuits for various electronic devices, such as smartphones, computers, and IoT devices.
Problems Solved
This technology solves the problem of efficiently routing connections within an integrated circuit without the need for additional metal layers, reducing complexity and improving performance.
Benefits
The benefits of this technology include improved efficiency in routing connections, reduced complexity in circuit design, and potentially enhanced overall performance of electronic devices.
Potential Commercial Applications
The potential commercial applications of this technology include the production of high-performance integrated circuits for consumer electronics, telecommunications equipment, and industrial automation systems.
Possible Prior Art
One possible prior art could be the use of multiple metal layers in integrated circuits to route connections between transistors. However, the specific configuration described in this patent application, with a horizontal routing track in a first metal layer and a backside routing track in a backside metal layer, may be a novel approach.
Unanswered Questions
How does this technology impact the overall size of the integrated circuit?
The abstract does not provide information on how this technology may impact the overall size of the integrated circuit. It would be interesting to know if this approach allows for more compact designs or if it has any implications on the physical dimensions of the circuit.
What are the potential limitations of this technology in terms of scalability to more complex circuits?
The abstract does not address the scalability of this technology to more complex circuits. It would be important to understand if there are any limitations or challenges when applying this approach to larger and more intricate integrated circuits.
Original Abstract Submitted
an integrated circuit includes a horizontal routing track in a first metal layer, and a backside routing track in a backside metal layer. the backside metal layer and the first metal layer are formed at opposite sides of a semiconductor substrate. the horizontal routing track is conductively connected to a first terminal of a first transistor without passing through a routing track in another metal layer. the backside routing track is conductively connected to a second terminal of the first transistor without passing through a routing track in another metal layer. one of the first terminal and the second terminal is a gate terminal of the first transistor while another one the first terminal and the second terminal is either a source terminal or a drain terminal of the first transistor.
