Taiwan semiconductor manufacturing company, ltd. (20240178177). Arrangement of Power-Grounds in Package Structures simplified abstract
Contents
- 1 Arrangement of Power-Grounds in Package Structures
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Arrangement of Power-Grounds in Package Structures - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
Arrangement of Power-Grounds in Package Structures
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chun-Hua Chang of Zhubei City (TW)
Fong-Yuan Chang of Hsinchu (TW)
Jyh Chwen Frank Lee of Palo Alto CA (US)
Arrangement of Power-Grounds in Package Structures - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178177 titled 'Arrangement of Power-Grounds in Package Structures
Simplified Explanation
The patent application describes a structure with a redistribution structure that includes a bottom layer and multiple upper layers. The structure also features a power-ground macro extending from the topmost layer to the bottommost layer, as well as a metal pad in the bottom layer that is electrically disconnected from the power-ground macro.
- Structure with redistribution structure
- Bottom layer and multiple upper layers
- Power-ground macro extending through layers
- Metal pad in bottom layer disconnected from power-ground macro
Potential Applications
This technology could be applied in semiconductor devices, integrated circuits, and electronic components where efficient power distribution and grounding are crucial.
Problems Solved
This innovation solves the problem of ensuring proper power distribution and grounding within complex structures, reducing the risk of electrical interference and signal degradation.
Benefits
The benefits of this technology include improved performance and reliability of electronic devices, enhanced signal integrity, and overall better functionality.
Potential Commercial Applications
This technology could be valuable in the manufacturing of high-performance electronic devices such as smartphones, computers, and other consumer electronics.
Possible Prior Art
One possible prior art could be the use of similar power-ground macros in semiconductor devices, but the specific configuration described in this patent application may be novel.
Unanswered Questions
How does this technology compare to existing power distribution methods in terms of efficiency and performance?
This article does not provide a direct comparison with existing power distribution methods, leaving the reader to speculate on the potential advantages or disadvantages of this technology.
What are the potential challenges in implementing this technology on a large scale in industrial manufacturing processes?
The article does not address the practical challenges that may arise when implementing this technology in mass production, such as cost, scalability, or compatibility with existing manufacturing processes.
Original Abstract Submitted
a structure includes a redistribution structure, which includes a bottom layer and a plurality of upper layers over the bottom layer. the redistribution structure also includes a power-ground macro extending from a topmost layer in the plurality of upper layers to a bottommost layer in the plurality of upper layers, and a metal pad in the bottom layer and overlapped by the power-ground macro. the metal pad is electrically disconnected from the power-ground macro.
