Taiwan semiconductor manufacturing company, ltd. (20240178173). CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE simplified abstract
Contents
- 1 CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chien-Cheng Chen of Hsinchu County (TW)
Pei-Haw Tsao of Nan-Chu, Tai-chung (TW)
CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178173 titled 'CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE
Simplified Explanation
The patent application describes a chip structure with a unique design for the conductive bump and support layer.
- The chip structure includes a substrate, an interconnect layer, a conductive pad, a conductive bump with a first portion, a second portion, and a neck portion, and a support layer with a different composition from the conductive bump.
- The conductive bump is positioned over the conductive pad and has a narrower neck portion between the first and second portions.
- The support layer is placed over the second portion of the conductive bump.
- A solder structure is located over the support layer.
Potential Applications
The technology described in this patent application could be used in semiconductor manufacturing, electronic devices, and integrated circuits.
Problems Solved
This technology solves the problem of ensuring proper electrical connections and mechanical support in chip structures, improving overall performance and reliability.
Benefits
The benefits of this technology include enhanced electrical conductivity, improved mechanical stability, and increased durability of chip structures.
Potential Commercial Applications
The technology could be applied in the production of various electronic devices, such as smartphones, tablets, computers, and other consumer electronics.
Possible Prior Art
One possible prior art could be the use of different compositions in support layers for electronic components, but the specific design of the conductive bump and support layer in this patent application appears to be novel.
=== What are the specific materials used in the support layer and conductive bump? The patent application does not specify the exact materials used in the support layer and conductive bump.
=== How does the design of the conductive bump improve the overall performance of the chip structure? The patent application does not provide detailed information on how the design of the conductive bump enhances the performance of the chip structure.
Original Abstract Submitted
a chip structure is provided. the chip structure includes a substrate. the chip structure includes an interconnect layer over the substrate. the chip structure includes a conductive pad over the interconnect layer. the chip structure includes a conductive bump over the conductive pad. the conductive bump has a first portion, a second portion, and a neck portion between the first portion and the second portion, the first portion is between the neck portion and the conductive pad, and the neck portion is narrower than both of the first portion and the second portion. the chip structure includes a support layer over the second portion of the conductive bump. a first composition of the support layer is different from a second composition of the conductive bump. the chip structure includes a solder structure over the support layer.
