Taiwan semiconductor manufacturing company, ltd. (20240178152). METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK simplified abstract
Contents
- 1 METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178152 titled 'METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK
Simplified Explanation
The present disclosure relates to a method for forming a mark, a packaging method for a semiconductor device, and a semiconductor device having the mark, wherein the marking material is a polymer compound with a light transmittance of less than 50%, suitable for laser sintering to form the mark.
- Polymer compound marking material with light transmittance less than 50%.
- Marking material sintered to form a cured product.
- Cured product can be used as a deflector to guide underfill flow and control flow rate.
Potential Applications
The technology can be applied in semiconductor packaging processes where precise marking and control of underfill flow are required.
Problems Solved
1. Uneven flow rate of underfill in semiconductor devices. 2. Lack of precise marking methods for semiconductor devices.
Benefits
1. Improved control over underfill flow. 2. Enhanced marking precision on semiconductor devices.
Potential Commercial Applications
1. Semiconductor manufacturing companies. 2. Electronics packaging companies.
Possible Prior Art
There are existing methods for marking and packaging semiconductor devices, but the use of a polymer compound with specific light transmittance for laser sintering may be a novel approach.
Unanswered Questions
How does the polymer compound affect the curing process of the marking material?
The abstract mentions that the marking material is sintered to form a cured product, but it does not provide details on how the polymer compound specifically influences this process.
What are the specific parameters for controlling the flow rate of underfill using the cured product as a deflector?
While the abstract mentions that the cured product can guide the flow of underfill and control its flow rate, it does not specify the exact parameters or methods for achieving this control.
Original Abstract Submitted
the present disclosure relates to a method for forming a mark, a packaging method for a semiconductor device, and a semiconductor device having the mark, wherein the marking material is a polymer compound and the light transmittance of the marking material is less than 50%, which is suitable for forming the mark on the semiconductor device by laser sintering, and the marking material is sintered to make the resin cross-link and cure to form a cured product. in addition, in one embodiment, the cured product formed by the marking material can be used as a deflector to guide the flow of the underfill and control the flow rate of underfill, so as to effectively solve the problem of uneven flow rate of the underfill.
