Taiwan semiconductor manufacturing company, ltd. (20240178150). SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Tzuan-Horng Liu of Hsinchu (TW)
SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178150 titled 'SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The semiconductor device package structure described in the abstract includes a redistribution structure, first and second semiconductor devices, a bridge die, conductive bumps, and solder material. The first semiconductor device is on one side of the redistribution structure, while the second semiconductor device and bridge die are on the opposite side. The conductive bumps are connected to the semiconductor devices and redistribution structure, with solder material connecting them.
- Redistributed structure with multiple semiconductor devices and bridge die
- Conductive bumps and solder material for electrical connections
Potential Applications
This technology can be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics where multiple semiconductor devices need to be connected efficiently.
Problems Solved
This technology solves the problem of efficiently connecting multiple semiconductor devices in a compact package structure, improving overall performance and reliability of electronic devices.
Benefits
The benefits of this technology include improved electrical connections, reduced footprint, enhanced performance, and increased reliability of electronic devices.
Potential Commercial Applications
The potential commercial applications of this technology include the semiconductor industry, consumer electronics manufacturers, and companies developing advanced electronic devices for various industries.
Possible Prior Art
One possible prior art for this technology could be the use of stacked die packages in semiconductor devices to improve performance and reduce footprint. Another could be the use of conductive bumps and solder material for electrical connections in electronic devices.
Unanswered Questions
How does this technology compare to existing semiconductor packaging solutions in terms of performance and reliability?
This article does not provide a direct comparison with existing semiconductor packaging solutions, so it is unclear how this technology stacks up against current industry standards.
What are the potential challenges or limitations of implementing this technology in mass production?
The article does not address the potential challenges or limitations of mass-producing semiconductor devices with this package structure, leaving room for further exploration into the feasibility of large-scale production.
Original Abstract Submitted
a semiconductor device package structure is provided, including a redistribution structure, a first semiconductor device, a second semiconductor device, a bridge die, a first conductive bump, and a second conductive bump bumps, a third conductive bumps, and a first solder material. the first semiconductor device is disposed on a first side of the redistribution structure, the second semiconductor device and the bridge die are disposed on a second side opposite to the first side. the first conductive bump is disposed on the first semiconductor device, the second conductive bump is disposed on the second side of the redistribution structure and the third conductive bump is disposed on the second semiconductor device. the first solder material is electrically connected between the second conductive bump and the third conductive bump, and the redistribution structure is electrically connected between the first conductive bump and the second conductive bump.
