Taiwan semiconductor manufacturing company, ltd. (20240178139). APPARATUS AND METHODS FOR GENERATING A CIRCUIT WITH HIGH DENSITY ROUTING LAYOUT simplified abstract
Contents
- 1 APPARATUS AND METHODS FOR GENERATING A CIRCUIT WITH HIGH DENSITY ROUTING LAYOUT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 APPARATUS AND METHODS FOR GENERATING A CIRCUIT WITH HIGH DENSITY ROUTING LAYOUT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
APPARATUS AND METHODS FOR GENERATING A CIRCUIT WITH HIGH DENSITY ROUTING LAYOUT
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Wei-An Lai of Hsinchu City (TW)
Shih-Wei Peng of Hsinchu City (TW)
Wei-Cheng Lin of Taichung City (TW)
Jiann-Tyng Tzeng of Hinchu City (TW)
APPARATUS AND METHODS FOR GENERATING A CIRCUIT WITH HIGH DENSITY ROUTING LAYOUT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178139 titled 'APPARATUS AND METHODS FOR GENERATING A CIRCUIT WITH HIGH DENSITY ROUTING LAYOUT
Simplified Explanation
The patent application describes an apparatus and methods for generating a physical layout for a high-density routing circuit in a semiconductor structure. The structure includes gate structures, metal lines, and vias formed in multiple dielectric layers to enable electrical connections.
- Gate structure, first metal lines, and first vias are formed in lower dielectric layers.
- Second metal lines and second vias are formed in upper dielectric layers.
- Vias connect metal lines to gate structures for electrical connections.
Potential Applications
This technology can be applied in the semiconductor industry for designing high-density routing circuits in integrated circuits.
Problems Solved
1. Efficient layout design for high-density routing circuits. 2. Improved electrical connectivity between metal lines and gate structures.
Benefits
1. Increased circuit density. 2. Enhanced electrical performance. 3. Simplified manufacturing process.
Potential Commercial Applications
"High-Density Routing Circuit Layout Design in Semiconductor Structures"
Possible Prior Art
Prior art in semiconductor layout design tools and methods may exist, but specific examples are not provided in the patent application.
Unanswered Questions
How does this technology impact overall circuit performance?
The article does not delve into the specific performance improvements achieved by this layout design. Further research or testing may be needed to quantify the impact on circuit performance.
Are there any limitations or drawbacks to this layout design approach?
The potential limitations or drawbacks of this technology, such as increased manufacturing complexity or cost implications, are not addressed in the article. Additional analysis or comparisons with existing methods could shed light on any limitations.
Original Abstract Submitted
apparatus and methods for generating a physical layout for a high density routing circuit are disclosed. an exemplary semiconductor structure includes: a gate structure; a plurality of first metal lines formed in a first dielectric layer below the gate structure; at least one first via formed in a second dielectric layer between the gate structure and the first dielectric layer; a plurality of second metal lines formed in a third dielectric layer over the gate structure; and at least one second via formed in a fourth dielectric layer between the gate structure and the third dielectric layer. each of the at least one first via is electrically connected to the gate structure and a corresponding one of the plurality of first metal lines. each of the at least one second via is electrically connected to the gate structure and a corresponding one of the plurality of second metal lines.
