Taiwan semiconductor manufacturing company, ltd. (20240178090). PACKAGE STRUCTURE simplified abstract
Contents
- 1 PACKAGE STRUCTURE
PACKAGE STRUCTURE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chung-Ming Weng of Taichung City (TW)
Tzu-Sung Huang of Tainan City (TW)
Hao-Yi Tsai of Hsinchu City (TW)
Ming-Hung Tseng of Miaoli County (TW)
Tsung-Hsien Chiang of Hsinchu (TW)
Yen-Liang Lin of Taichung City (TW)
PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178090 titled 'PACKAGE STRUCTURE
Simplified Explanation
The patent application describes a package structure for an electronic device, which includes a semiconductor die encapsulated by an insulating material and a redistribution layer structure on top of the die. The redistribution layer structure consists of various dielectric and conductive layers, with the outermost conductive layer embedded in the dielectric layer. The electronic device is connected to this outermost conductive layer.
- Semiconductor die encapsulated by an insulating material
- Redistribution layer structure with dielectric and conductive layers
- Electronic device connected to outermost conductive layer
Potential Applications
The technology described in this patent application could be applied in various electronic devices such as smartphones, tablets, and computers.
Problems Solved
This technology helps in protecting the semiconductor die and providing a reliable electrical connection for the electronic device.
Benefits
The benefits of this technology include improved reliability, protection of the semiconductor die, and enhanced electrical connections.
Potential Commercial Applications
The technology could be used in the manufacturing of consumer electronics, industrial equipment, and automotive electronics.
Possible Prior Art
One possible prior art could be the use of similar encapsulation and redistribution layer structures in electronic devices.
Unanswered Questions
How does this technology compare to existing packaging structures in terms of reliability and performance?
This article does not provide a direct comparison with existing packaging structures, so it is unclear how this technology fares in terms of reliability and performance.
What are the potential challenges in implementing this technology on a large scale for commercial production?
The article does not address the potential challenges in scaling up the production of devices using this technology, leaving this question unanswered.
Original Abstract Submitted
a package structure including a semiconductor die, a redistribution layer structure and an electronic device is provided. the semiconductor die is laterally encapsulated by an insulating encapsulation. the redistribution layer structure is disposed on the semiconductor die and the insulating encapsulation. the redistribution layer structure includes a backside dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the backside dielectric layer and the inter-dielectric layers. the electronic device is disposed over the backside dielectric layer and electrically connected to an outermost redistribution conductive layer among the redistribution conductive layers, wherein the outermost redistribution conductive layer is embedded in the backside dielectric layer, and the backside dielectric layer comprises a ring-shaped recess covered by the outermost redistribution conductive layer.
