Taiwan semiconductor manufacturing company, ltd. (20240178086). PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRUCTURE simplified abstract
Contents
- 1 PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRUCTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRUCTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRUCTURE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Che-Yu Yeh of New Taipei City (TW)
Chien-Chia Chiu of Taoyan City (TW)
Hua-Wei Tseng of New Taipei City (TW)
Wan-Yu Lee of Taipei City (TW)
PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178086 titled 'PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRUCTURE
Simplified Explanation
The patent application describes a package structure that includes a die, through vias, a dummy structure, an encapsulant, and a redistribution structure. The through vias surround the die, the dummy structure is positioned between the die and the through vias, and the encapsulant encapsulates the components. The redistribution structure is electrically connected to the die and through vias.
- Die surrounded by through vias
- Dummy structure positioned between die and through vias
- Encapsulant encapsulates components
- Redistribution structure electrically connected to die and through vias
Potential Applications
The technology described in the patent application could be applied in the following areas:
- Semiconductor packaging
- Integrated circuit manufacturing
- Electronic device assembly
Problems Solved
The technology addresses the following issues:
- Ensuring proper electrical connections in package structures
- Enhancing the reliability of electronic components
- Improving the performance of integrated circuits
Benefits
The technology offers the following benefits:
- Increased efficiency in electronic device manufacturing
- Enhanced durability of package structures
- Improved signal transmission in integrated circuits
Potential Commercial Applications
The technology could find commercial applications in:
- Consumer electronics
- Automotive electronics
- Aerospace industry
Possible Prior Art
One possible prior art for this technology could be the use of dummy structures in semiconductor packaging to improve electrical connections and reliability.
Unanswered Questions
How does the redistribution structure improve the electrical connections in the package structure?
The redistribution structure is mentioned in the abstract, but the specific details of how it enhances electrical connections are not provided.
What materials are used in the encapsulant to ensure proper encapsulation of the components?
The abstract mentions the encapsulant, but the specific materials used and their properties are not detailed.
Original Abstract Submitted
disclosed are a package, a package structure and a method of manufacturing a package structure. in one embodiment, the package includes a die, a plurality of through vias, at least one dummy structure, an encapsulant and a redistribution structure. the plurality of through vias surround the die. the at least one dummy structure is disposed between the die and the plurality of through vias and adjacent to at least one corner of the die. the encapsulant encapsulates the die, the plurality of through vias and the at least one dummy structure. the redistribution structure is disposed on the die, the plurality of through vias, the at least one dummy structure and the encapsulant and electrically connected to the die and the plurality of through vias.
