Taiwan semiconductor manufacturing company, ltd. (20240178015). MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE DEVICE, AND WORKPIECE HANDLING APPARATUS simplified abstract
Contents
- 1 MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE DEVICE, AND WORKPIECE HANDLING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE DEVICE, AND WORKPIECE HANDLING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE DEVICE, AND WORKPIECE HANDLING APPARATUS
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chien-Wei Wu of New Taipei City (TW)
Yung-Chi Lin of New Taipei City (TW)
MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE DEVICE, AND WORKPIECE HANDLING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178015 titled 'MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE DEVICE, AND WORKPIECE HANDLING APPARATUS
Simplified Explanation
The manufacturing method of a semiconductor package involves picking up a semiconductor device from a carrier, placing it onto a substrate, encapsulating it with a material, forming a redistribution structure, and finally removing the substrate.
- Pick and place device with a flexible head and bonding portion
- Minimum width of the neck portion is smaller than the maximum width of the bonding portion
- Lateral encapsulation of the semiconductor device
- Formation of a redistribution structure
- Removal of the substrate
Potential Applications
The technology can be applied in the manufacturing of various semiconductor devices such as integrated circuits, sensors, and microprocessors.
Problems Solved
1. Efficient and precise placement of semiconductor devices onto substrates 2. Ensuring proper encapsulation and protection of the semiconductor device
Benefits
1. Improved manufacturing process efficiency 2. Enhanced reliability and durability of semiconductor packages
Potential Commercial Applications
Optimizing semiconductor packaging processes for industries such as electronics, telecommunications, and automotive.
Possible Prior Art
One possible prior art could be the use of robotic pick and place devices in semiconductor manufacturing processes.
Unanswered Questions
How does the size of the neck portion impact the overall performance of the pick and place device?
The size of the neck portion affects the flexibility and precision of the pick and place device in handling semiconductor devices.
What materials are commonly used for the encapsulating material in semiconductor packaging?
Common materials used for encapsulating semiconductor devices include epoxy resins, silicone, and polyimides.
Original Abstract Submitted
a manufacturing method of a semiconductor package includes the following steps. a semiconductor device is picked up from a carrier by a pick and place device, wherein the pick and place device includes a flexible head having a bonding portion configured to be in contact with the semiconductor device, a neck portion connecting the bonding portion, wherein a minimum width of the neck portion is substantially smaller than a maximum width of the bonding portion. the semiconductor device is placed and pressed onto a substrate by the pick and place device. an encapsulating material is formed over the substrate to laterally encapsulating the semiconductor device. a redistribution structure is formed over the semiconductor device and the encapsulating material. the substrate is removed.
