Taiwan semiconductor manufacturing company, ltd. (20240178013). SYSTEMS AND METHODS FOR IN-SITU MARANGONI CLEANING simplified abstract

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SYSTEMS AND METHODS FOR IN-SITU MARANGONI CLEANING

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Wei-Chun Hsu of Hsin-Chu (TW)

Shu-Yen Wang of Hsin-Chu (TW)

Chui-Ya Peng of Hsinchu City (TW)

SYSTEMS AND METHODS FOR IN-SITU MARANGONI CLEANING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240178013 titled 'SYSTEMS AND METHODS FOR IN-SITU MARANGONI CLEANING

Simplified Explanation

The abstract describes a method for cleaning wafers in a chamber by immersing them in a bath, removing them with a solvent, analyzing a parameter value from the gas, and performing remediation if the value exceeds a threshold.

  • Immersing wafer in a cleaning bath within a chamber
  • Removing wafer with a solvent into a gas within the chamber
  • Analyzing a parameter value from the gas
  • Performing remediation if the parameter value is beyond a threshold

Potential Applications

This technology could be applied in semiconductor manufacturing processes, where clean wafers are crucial for high-quality chip production.

Problems Solved

This method solves the issue of determining when a wafer needs remediation during the cleaning process, ensuring that only wafers with specific parameter values are treated.

Benefits

- Improved efficiency in wafer cleaning processes - Enhanced quality control in semiconductor manufacturing - Cost savings by targeting only wafers that require remediation

Potential Commercial Applications

  • "Wafer Cleaning Method for Semiconductor Manufacturing" could be a suitable title for this section.
  • This technology could be utilized by semiconductor companies looking to streamline their manufacturing processes and enhance the quality of their products.

Possible Prior Art

There may be prior art related to wafer cleaning methods in semiconductor manufacturing, but specific examples are not provided in this context.

Unanswered Questions

How does this method compare to traditional wafer cleaning processes?

This article does not provide a direct comparison between this innovative method and traditional wafer cleaning processes. It would be beneficial to understand the specific advantages and differences between the two approaches.

What are the potential limitations or challenges of implementing this technology in a manufacturing setting?

The article does not address any potential limitations or challenges that may arise when implementing this technology in a manufacturing environment. It would be important to consider factors such as scalability, cost-effectiveness, and compatibility with existing equipment.


Original Abstract Submitted

in an embodiment, a method includes: immersing a wafer in a bath within a cleaning chamber, removing the wafer out of the bath through a solvent and into a gas within the cleaning chamber, determining a parameter value from the gas; and performing remediation within the cleaning chamber in response to determining that the parameter value is beyond a threshold value.