Taiwan semiconductor manufacturing company, ltd. (20240177988). SEMICONDUCTOR FABRICATING SYSTEM HAVING HYBRID BRUSH ASSEMBLY simplified abstract
Contents
- 1 SEMICONDUCTOR FABRICATING SYSTEM HAVING HYBRID BRUSH ASSEMBLY
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR FABRICATING SYSTEM HAVING HYBRID BRUSH ASSEMBLY - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR FABRICATING SYSTEM HAVING HYBRID BRUSH ASSEMBLY
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hsuan-Ying Mai of Taoyuan City (TW)
Hui-Chun Lee of Hsinchu City (TW)
SEMICONDUCTOR FABRICATING SYSTEM HAVING HYBRID BRUSH ASSEMBLY - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240177988 titled 'SEMICONDUCTOR FABRICATING SYSTEM HAVING HYBRID BRUSH ASSEMBLY
Simplified Explanation
The method described in the patent application involves using a brush assembly with inner and outer brush members of different rigidities to clean the backside surface of a semiconductor wafer by rotating the brush assembly against it.
- The method involves placing a semiconductor wafer over a wafer stage.
- A brush assembly with inner and outer brush members is pressed against the backside surface of the wafer.
- The outer brush member is made of a material with lower rigidity than the inner brush member.
- The brush assembly is rotated relative to the semiconductor wafer to clean it.
Potential Applications
The technology could be used in semiconductor manufacturing processes to ensure the cleanliness of wafers before further processing steps.
Problems Solved
This technology helps in removing contaminants and particles from the backside surface of semiconductor wafers, which is crucial for maintaining the quality and performance of the wafers during manufacturing.
Benefits
The method provides a more efficient and effective way of cleaning semiconductor wafers compared to traditional methods, potentially leading to higher yields and improved product quality.
Potential Commercial Applications
The technology could be valuable for semiconductor fabrication facilities looking to optimize their manufacturing processes and improve the reliability of their products.
Possible Prior Art
One possible prior art could be the use of different brush materials with varying rigidities in cleaning processes for other types of surfaces, such as in the cleaning of optical lenses.
Unanswered Questions
How does the technology impact the overall yield of semiconductor manufacturing processes?
The article does not provide specific data or analysis on how the technology may affect the yield of semiconductor manufacturing processes. Further research or testing may be needed to determine the exact impact on yield.
What are the potential maintenance requirements for the brush assembly in this method?
The article does not address the maintenance needs or longevity of the brush assembly used in the cleaning process. Understanding the maintenance requirements could be crucial for implementing the technology in a manufacturing setting.
Original Abstract Submitted
in accordance with some embodiments, a method includes placing a semiconductor wafer over a wafer stage; pressing a brush assembly against a backside surface of the semiconductor wafer, wherein the brush assembly comprises an inner brush member and an outer brush member laterally surrounding the inner brush member, and the outer brush member is made of a material having a lower rigidity than the inner brush member; rotating the brush assembly relative to the semiconductor wafer.
