Taiwan semiconductor manufacturing company, ltd. (20240120295). SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
- 1 SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Szu-Hsien Lee of Tainan City (TW)
Yun-Chung Wu of Taipei City (TW)
Pei-Wei Lee of Oingtung County (TW)
SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240120295 titled 'SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The semiconductor chip described in the patent application includes an array of pillar structures with ground pillars and working pillars, as well as dummy pillar structures surrounding them. Active devices inside the chip are connected to the working pillars, while the ground pillars and dummy pillars form a current pathway on the front surface of the chip.
- Pillar structures with ground and working pillars:
- The semiconductor chip features an array of pillar structures, each including a ground pillar and multiple working pillars spaced apart from the ground pillar.
- Dummy pillar structures:
- Surrounding the pillar structures are dummy pillar structures that help form a current pathway on the front surface of the chip.
- Electrical connections:
- Active devices within the chip are electrically connected to the working pillars, while the ground pillars and dummy pillars are also electrically connected to create a current pathway.
Potential Applications
The technology described in the patent application could be applied in: - Semiconductor manufacturing - Integrated circuit design - Electronic device production
Problems Solved
This technology helps address issues related to: - Electrical connectivity in semiconductor chips - Efficient current pathways - Pillar structure design in semiconductor devices
Benefits
The benefits of this technology include: - Improved electrical connections - Enhanced performance of active devices - More efficient current pathways
Potential Commercial Applications
The technology could find commercial applications in: - Consumer electronics - Telecommunications - Automotive industry
Possible Prior Art
One possible prior art for this technology could be the use of pillar structures in semiconductor chips for electrical connections.
Unanswered Questions
How does this technology compare to traditional methods of forming current pathways in semiconductor chips?
This article does not provide a direct comparison between this technology and traditional methods of forming current pathways in semiconductor chips.
What are the specific dimensions and materials used in the pillar structures described in the patent application?
The article does not delve into the specific dimensions and materials used in the pillar structures outlined in the patent application.
Original Abstract Submitted
a semiconductor chip and a manufacturing method thereof are provided. the semiconductor chip includes: an array of pillar structures, disposed on a front surface of the semiconductor chip, and respectively including a ground pillar and multiple working pillars laterally spaced apart from and substantially parallel with a line portion of the ground pillar; and dummy pillar structures, disposed on the front surface of the semiconductor chip and laterally surrounding the pillar structures. active devices formed inside the semiconductor chip are electrically connected to the working pillar. the ground pillars of the pillar structures and the dummy pillar structures are electrically connected to form a current pathway on the front surface of the semiconductor chip.
