Taiwan semiconductor manufacturing company, ltd. (20240118491). PHOTONIC SEMICONDUCTOR DEVICE, PHOTONIC SEMICONDUCTOR PACKAGE USING THE SAME AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
- 1 PHOTONIC SEMICONDUCTOR DEVICE, PHOTONIC SEMICONDUCTOR PACKAGE USING THE SAME AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PHOTONIC SEMICONDUCTOR DEVICE, PHOTONIC SEMICONDUCTOR PACKAGE USING THE SAME AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PHOTONIC SEMICONDUCTOR DEVICE, PHOTONIC SEMICONDUCTOR PACKAGE USING THE SAME AND MANUFACTURING METHOD THEREOF
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hsing-Kuo Hsia of Hsinchu (TW)
PHOTONIC SEMICONDUCTOR DEVICE, PHOTONIC SEMICONDUCTOR PACKAGE USING THE SAME AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240118491 titled 'PHOTONIC SEMICONDUCTOR DEVICE, PHOTONIC SEMICONDUCTOR PACKAGE USING THE SAME AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The abstract describes a photonic semiconductor device that includes a light-emitting component and a photonic integrated circuit. The device is designed to efficiently transmit light emitted from the gain medium layer to the second taper portion through optical coupling in a short length of an optical coupling path.
- The device includes a light-emitting component with a gain medium layer, a first contact layer, and a first optical coupling layer stacked on top of each other.
- The photonic integrated circuit includes a second optical coupling layer.
- The first optical coupling layer has a first taper portion, and the second optical coupling layer has a second taper portion that overlaps with the first taper portion in the stacking direction.
Potential Applications
This technology could be applied in:
- High-speed data communication systems
- Optical sensing devices
- Laser diode modules
Problems Solved
This technology solves the problem of efficiently transmitting light emitted from the gain medium layer to the photonic integrated circuit in a short optical coupling path.
Benefits
- Improved efficiency in light transmission
- Compact design
- Enhanced performance in photonic applications
Potential Commercial Applications
- Telecommunications industry
- Biomedical imaging devices
- Industrial laser systems
Possible Prior Art
One possible prior art could be the integration of light-emitting components with photonic integrated circuits in semiconductor devices for optical communication systems.
Unanswered Questions
How does this technology compare to existing methods of light transmission in photonic semiconductor devices?
This article does not provide a direct comparison with existing methods of light transmission in photonic semiconductor devices. Further research or experimentation may be needed to evaluate the performance and efficiency of this technology compared to other methods.
What are the specific materials used in the construction of the light-emitting component and the photonic integrated circuit?
The article does not specify the exact materials used in the construction of the light-emitting component and the photonic integrated circuit. Understanding the materials could provide insights into the performance and durability of the device.
Original Abstract Submitted
a photonic semiconductor device including a light-emitting component and a photonic integrated circuit is provided. the light-emitting component at least includes a gain medium layer, a first contact layer and a first optical coupling layer stacked to each other. the photonic integrated circuit includes a second optical coupling layer. the light-emitting component and the photonic integrated circuit are stacked in a stacking direction, the first optical coupling layer has a first taper portion, the second optical coupling layer has a second taper portion, and the first taper portion and the second taper portion overlap in the stacking direction. accordingly, the light emitted from the gain medium layer may be transmitted to the second taper portion from the first taper portion by optical coupling in a short length of an optical coupling path.
