Taiwan semiconductor manufacturing company, ltd. (20240113056). SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.9.1 Unanswered Questions
- 1.9.2 How does this technology compare to existing methods of integrating optical components in semiconductor packages?
- 1.9.3 What are the specific performance metrics or test results that demonstrate the effectiveness of the dielectric-to-dielectric and metal-to-metal bonds in this technology?
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chih-Wei Tseng of Hsinchu (TW)
Jui Lin Chao of New Taipei City (TW)
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240113056 titled 'SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
Simplified Explanation
The semiconductor package described in the abstract includes a first interposer with optical components, dielectric layers, and conductive connectors, as well as a photonic package bonded to the first interposer with dielectric-to-dielectric and metal-to-metal bonds.
- First interposer with optical components, dielectric layers, and conductive connectors
- Photonic package bonded to the first interposer with dielectric-to-dielectric and metal-to-metal bonds
Potential Applications
The technology described in this patent application could be applied in the fields of telecommunications, data centers, and high-speed computing where high-performance optical components are required.
Problems Solved
This technology solves the problem of integrating optical components with semiconductor packages in a reliable and efficient manner, ensuring proper alignment and connectivity between different components.
Benefits
The benefits of this technology include improved performance, reliability, and scalability of semiconductor packages with integrated optical components, leading to enhanced functionality and reduced signal loss.
Potential Commercial Applications
- High-speed data transmission systems
- Optical networking equipment
Possible Prior Art
One possible prior art for this technology could be the integration of optical components in semiconductor packages using traditional bonding methods, which may not provide the same level of reliability and performance as the dielectric-to-dielectric and metal-to-metal bonds described in this patent application.
Unanswered Questions
How does this technology compare to existing methods of integrating optical components in semiconductor packages?
This article does not provide a direct comparison with existing methods, leaving the reader to wonder about the specific advantages and disadvantages of this new approach.
What are the specific performance metrics or test results that demonstrate the effectiveness of the dielectric-to-dielectric and metal-to-metal bonds in this technology?
The article does not mention any specific performance metrics or test results, leaving the reader curious about the actual performance improvements achieved with this new bonding method.
Original Abstract Submitted
a semiconductor package including a first interposer comprising a first substrate, first optical components over the first substrate, a first dielectric layer over the first optical components, and first conductive connectors embedded in the first dielectric layer, a photonic package bonded to a first side of the first interposer, where a first bond between the first interposer and the photonic package includes a dielectric-to-dielectric bond between a second dielectric layer on the photonic package and the first dielectric layer, and a second bond between the first interposer and the photonic package includes a metal-to-metal bond between a second conductive connector on the photonic package and a first one of the first conductive connectors and a first die bonded to the first side of the first interposer.
