Taiwan semiconductor manufacturing company, ltd. (20240113032). PACKAGED INTERCONNECT STRUCTURES simplified abstract

PACKAGED INTERCONNECT STRUCTURES

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Kai-Fung Chang of Taipei City (TW)

Chin-Wei Liang of Zhubei City (TW)

Sheng-Feng Weng of Taichung City (TW)

Ming-Yu Yen of Miaoli County (TW)

Cheyu Liu of Hsinchu County (TW)

Hung-Chih Chen of Hsinchu City (TW)

Yi-Yang Lei of Taichung City (TW)

Ching-Hua Hsieh of Hsinchu (TW)

PACKAGED INTERCONNECT STRUCTURES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240113032 titled 'PACKAGED INTERCONNECT STRUCTURES

Simplified Explanation

The abstract describes a method of manufacturing semiconductor die packages using pre-manufactured interconnect structure packages placed on a carrier substrate. The interconnect structure packages are surrounded by a molding compound layer along with the semiconductor die package.

• Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) are pre-manufactured.
• Interconnect structure packages are placed on a carrier substrate during manufacturing of a semiconductor device package.
• Semiconductor die package is placed on the carrier substrate adjacent to the interconnect structure packages.
• A molding compound layer is formed around and in between the interconnect structure packages and the semiconductor die package.

Potential Applications

This technology can be applied in the manufacturing of advanced semiconductor devices, such as high-performance microprocessors, memory chips, and other integrated circuits.

Problems Solved

This technology streamlines the manufacturing process of semiconductor die packages by utilizing pre-manufactured interconnect structure packages, reducing production time and costs.

Benefits

- Improved efficiency in semiconductor die package manufacturing - Enhanced reliability and performance of semiconductor devices - Cost-effective production process

Potential Commercial Applications

The technology can be utilized by semiconductor manufacturers, electronics companies, and other industries involved in the production of advanced electronic devices.

Possible Prior Art

Prior art in the field of semiconductor packaging includes traditional methods of forming interconnect structures directly on carrier substrates during the manufacturing process.

How does this technology impact the overall performance of semiconductor devices?

This technology can potentially improve the performance of semiconductor devices by enhancing the interconnectivity between components, leading to faster data transfer speeds and overall efficiency.

What are the environmental implications of using pre-manufactured interconnect structure packages in semiconductor die packaging?

The environmental impact of this technology is not explicitly addressed in the abstract. However, using pre-manufactured interconnect structure packages may reduce waste and energy consumption in the manufacturing process, contributing to a more sustainable production approach.

Original Abstract Submitted

interconnect structure packages (e.g., through silicon vias (tsv) packages, through interlayer via (tiv) packages) may be pre-manufactured as opposed to forming tivs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. the interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. a molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.