Taiwan semiconductor manufacturing company, ltd. (20240105627). Semiconductor Devices and Methods of Manufacture simplified abstract
Contents
- 1 Semiconductor Devices and Methods of Manufacture
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Semiconductor Devices and Methods of Manufacture - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
Semiconductor Devices and Methods of Manufacture
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Shang-Yun Hou of Jubei City (TW)
Hsien-Pin Hu of Zhubei City (TW)
Semiconductor Devices and Methods of Manufacture - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105627 titled 'Semiconductor Devices and Methods of Manufacture
Simplified Explanation
The semiconductor device described in the abstract includes a substrate, two interposers, a bridge component, first dies, and second dies.
- The semiconductor device consists of a substrate, which serves as the foundation for the device.
- Two interposers are bonded to the substrate, providing a connection between different components of the device.
- A bridge component electrically connects the two interposers, allowing for communication between them.
- Multiple first dies are bonded to the first interposer, while multiple second dies are bonded to the second interposer.
Potential Applications
The technology described in this patent application could have potential applications in:
- High-performance computing systems
- Advanced telecommunications equipment
- Automotive electronics
Problems Solved
This technology helps address the following issues:
- Improving signal transmission between different components
- Enhancing overall device performance and reliability
- Facilitating more efficient data processing
Benefits
The use of this technology offers the following benefits:
- Increased speed and efficiency in data transfer
- Enhanced connectivity between various parts of the semiconductor device
- Improved overall functionality and performance
Potential Commercial Applications
A potential commercial application for this technology could be in:
- Data centers for high-speed data processing
- Telecommunications infrastructure for improved connectivity
- Automotive industry for advanced electronic systems
Possible Prior Art
One possible prior art for this technology could be the use of multi-chip modules in semiconductor devices, where multiple dies are interconnected on a single substrate.
Unanswered Questions
How does this technology compare to existing multi-chip module designs in terms of performance and efficiency?
The article does not provide a direct comparison between this technology and existing multi-chip module designs.
What are the specific manufacturing processes involved in bonding the dies to the interposers and the substrate?
The article does not detail the specific manufacturing processes used in bonding the dies to the interposers and the substrate.
Original Abstract Submitted
semiconductor devices and methods of manufacture are provided. in embodiments the semiconductor device includes a substrate, a first interposer bonded to the substrate, a second interposer bonded to the substrate, a bridge component electrically connecting the first interposer to the second interposer, two or more first dies bonded to the first interposer; and two or more second dies bonded to the second interposer.
