Taiwan semiconductor manufacturing company, ltd. (20240103359). RETICLE INSPECTION AND PURGING METHOD AND TOOL simplified abstract
Contents
- 1 RETICLE INSPECTION AND PURGING METHOD AND TOOL
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 RETICLE INSPECTION AND PURGING METHOD AND TOOL - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
RETICLE INSPECTION AND PURGING METHOD AND TOOL
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Xianhui Zhou of Shanghai City (CN)
Lei Wang of Shanghai City (CN)
Zihao Zhang of Shanghai City (CN)
Huiming Xu of Shanghai City (CN)
RETICLE INSPECTION AND PURGING METHOD AND TOOL - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240103359 titled 'RETICLE INSPECTION AND PURGING METHOD AND TOOL
Simplified Explanation
The abstract describes a method for inspecting and purging reticles in a lithography tool.
- First reticle moved from load port to inspection tool outside lithography tool
- First reticle inspected outside using inspection tool
- Determination made on whether reticle is acceptable for exposure
- If reticle is not acceptable, it is purged
Potential Applications
This technology can be applied in semiconductor manufacturing facilities where lithography tools are used to produce integrated circuits. It can also be used in other industries that require precise imaging processes.
Problems Solved
1. Ensures that only acceptable reticles are used for exposure, reducing the risk of defects in the final product. 2. Streamlines the process of identifying and purging faulty reticles, saving time and resources.
Benefits
1. Improved quality control in the manufacturing process. 2. Increased efficiency by automating the inspection and purging of reticles. 3. Cost savings by preventing defects and rework.
Potential Commercial Applications
Optimizing Reticle Inspection and Purging Method for Enhanced Quality Control in Semiconductor Manufacturing
Possible Prior Art
One possible prior art could be the use of automated reticle inspection systems in semiconductor manufacturing facilities. These systems may have similar functions but may not include the specific purging step described in this patent application.
Unanswered Questions
How does the purging process work in detail?
The abstract mentions purging the reticle if it is not acceptable for exposure, but it does not provide specific details on how this purging process is carried out.
Are there any limitations to this method?
It would be important to know if there are any specific limitations or constraints to implementing this method in different types of lithography tools or manufacturing environments.
Original Abstract Submitted
a reticle inspection and purging method comprises following steps. a first reticle is moved from a first load port of a lithography tool to a reticle inspection tool located outside the lithography tool. the first reticle is inspected using the reticle inspection tool located outside the lithography tool. whether the first reticle is acceptable for exposure is determined based on the inspection result. in response the determination determines that the first reticle is not acceptable for exposure, the first reticle is purged.
