Taiwan semiconductor manufacturing co., ltd. (20240329317). MICRO-RING WAVEGUIDE HEATER simplified abstract

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MICRO-RING WAVEGUIDE HEATER

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Chan-Hong Chern of Palo Alto CA (US)

MICRO-RING WAVEGUIDE HEATER - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240329317 titled 'MICRO-RING WAVEGUIDE HEATER

The abstract describes an integrated chip with a semiconductor waveguide layer over a base dielectric layer. The semiconductor waveguide layer includes a bus waveguide and a micro-ring waveguide, with a heater positioned over the micro-ring waveguide.

  • The chip features a heater with a heater ring, first and second heater contact pads, and heater arms extending from the heater ring to the contact pads.
  • The first and second contacts are coupled to the heater at the respective contact pads.
  • The width of the first heater arm increases non-linearly as the distance from the heater ring increases.

Potential Applications: - Optical communication systems - Photonic integrated circuits - High-speed data transmission technologies

Problems Solved: - Efficient heat control in semiconductor devices - Enhanced performance of waveguide structures

Benefits: - Improved thermal management - Increased reliability and stability of optical components - Higher data transmission speeds

Commercial Applications: Title: "Advanced Photonic Integrated Circuits for High-Speed Data Transmission" This technology can be utilized in telecommunications, data centers, and networking equipment to enhance data transmission speeds and efficiency.

Prior Art: Researchers can explore existing patents related to semiconductor waveguides, micro-ring waveguides, and integrated chip technologies to understand the evolution of this field.

Frequently Updated Research: Researchers are constantly working on improving the design and performance of integrated chips with semiconductor waveguide layers to meet the growing demands of high-speed data transmission.

Questions about the Technology: 1. How does the non-linear increase in width of the heater arm contribute to the efficiency of heat control in the integrated chip? 2. What are the key differences between a bus waveguide and a micro-ring waveguide in terms of their functionality and applications?


Original Abstract Submitted

an integrated chip including a semiconductor waveguide layer over a base dielectric layer. the semiconductor waveguide layer forms a bus waveguide and a micro-ring waveguide alongside the bus waveguide. a heater is over the micro-ring waveguide. the heater includes a heater ring, a first heater contact pad, a first heater arm extending from the heater ring to the first heater contact pad, a second heater contact pad, and a second heater arm extending from the heater ring to the second heater contact pad. a first contact is coupled to the heater at the first heater contact pad. a second contact is coupled to the heater at the second heater contact pad. a width of the first heater arm increases non-linearly as a distance from the heater ring increases.

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