Taiwan semiconductor manufacturing co., ltd. (20240329298). MULTI-TIERED SEMICONDUCTOR WAVEGUIDE AND MULTI-TIERED WAVEGUIDE HEATER simplified abstract

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MULTI-TIERED SEMICONDUCTOR WAVEGUIDE AND MULTI-TIERED WAVEGUIDE HEATER

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Wei-Kang Liu of Taichung City (TW)

Hau-Yan Lu of Hsinchu City (TW)

Ying Kit Felix Tsui of Cupertino CA (US)

MULTI-TIERED SEMICONDUCTOR WAVEGUIDE AND MULTI-TIERED WAVEGUIDE HEATER - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240329298 titled 'MULTI-TIERED SEMICONDUCTOR WAVEGUIDE AND MULTI-TIERED WAVEGUIDE HEATER

Simplified Explanation: The patent application describes an integrated chip with a multi-tiered semiconductor waveguide layer and a multi-tiered conductive heater layer over a base dielectric layer.

  • The chip includes a base dielectric layer.
  • A multi-tiered semiconductor waveguide layer is positioned over the base dielectric layer.
  • The semiconductor waveguide layer has a first waveguide tier with a certain width at a specific height.
  • A second waveguide tier with a greater width is located at a lower height than the first tier.
  • A cladding layer is placed over the semiconductor waveguide layer.
  • A multi-tiered conductive heater layer is positioned over the cladding layer.
  • The conductive heater layer includes a first heater tier over the first waveguide tier and a pair of second heater tiers at the same height as the first tier, on opposite sides of the first waveguide tier.

Key Features and Innovation:

  • Integration of a multi-tiered semiconductor waveguide layer and a multi-tiered conductive heater layer on a base dielectric layer.
  • Different widths and heights of the waveguide tiers for optimized performance.
  • Cladding layer for protection and insulation.
  • Conductive heater layer for temperature control and regulation.

Potential Applications:

  • Optical communication systems.
  • Photonic integrated circuits.
  • High-speed data transmission.
  • Quantum computing.

Problems Solved:

  • Efficient heat dissipation in semiconductor devices.
  • Enhanced performance of waveguide systems.
  • Precise temperature control in integrated chips.

Benefits:

  • Improved signal transmission.
  • Higher data transfer rates.
  • Increased reliability and longevity of semiconductor devices.

Commercial Applications: Potential commercial applications include:

  • Telecommunications industry for high-speed data transmission.
  • Electronics manufacturers for advanced integrated chips.
  • Research institutions for quantum computing development.

Prior Art: Readers can explore prior art related to integrated chips, semiconductor waveguides, and conductive heater layers in the field of photonics and semiconductor technology.

Frequently Updated Research: Stay updated on the latest advancements in integrated chip technology, semiconductor waveguides, and conductive heater layers for photonics applications.

Questions about Integrated Chip Technology: 1. What are the key components of an integrated chip? 2. How does the integration of semiconductor waveguides and conductive heater layers improve chip performance?


Original Abstract Submitted

an integrated chip including a base dielectric layer and a multi-tiered semiconductor waveguide layer over the base dielectric layer. the multi-tiered semiconductor waveguide layer has a first waveguide tier having a first width at a first height over the base dielectric layer. the multi-tiered semiconductor waveguide layer has a second waveguide tier having a second width, greater than the first width, at a second height, less than the first height, over the base dielectric layer. a cladding layer is over the multi-tiered semiconductor waveguide layer. a multi-tiered conductive heater layer is over the cladding layer. the multi-tiered conductive heater layer has a first heater tier over the first waveguide tier. the multi-tiered conductive heater layer has a pair of second heater tiers at the first height, over the second waveguide tier, and on opposite sides of the first waveguide tier.

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