Taiwan semiconductor manufacturing co., ltd. (20240329113). WAFER TEST PAD simplified abstract
Contents
WAFER TEST PAD
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Zhen De Ma of New Taipei City (TW)
Lee-Wen Hsu of Hsinchu City (TW)
Liang-Wei Wang of Hsinchu County (TW)
WAFER TEST PAD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240329113 titled 'WAFER TEST PAD
The abstract of this patent application describes a redistribution structure that includes multiple layers and features for electronic devices.
- The redistribution structure consists of a first dielectric layer, a mesh metal feature with a base and frame portion, a second dielectric layer, a redistribution feature, and a passivation structure.
- The mesh metal feature is surrounded by the frame portion and includes contact vias that extend through the second dielectric layer.
- A pad opening exposes the top surface of the redistribution feature for connection purposes.
Potential Applications: - This technology can be applied in the manufacturing of integrated circuits and electronic devices. - It can improve the efficiency and performance of semiconductor devices.
Problems Solved: - The redistribution structure helps in enhancing the connectivity and signal transmission within electronic components. - It provides a reliable and compact solution for routing signals in complex circuit designs.
Benefits: - Improved signal integrity and reliability in electronic devices. - Enhanced performance and functionality of integrated circuits. - Compact and efficient design for space-constrained applications.
Commercial Applications: Title: Advanced Redistribution Structure for Integrated Circuits This technology can be used in the production of high-performance electronic devices such as smartphones, tablets, and computers. It can also benefit industries involved in semiconductor manufacturing and electronics production.
Prior Art: Readers interested in prior art related to this technology can explore patents and research papers in the field of semiconductor packaging, redistribution structures, and integrated circuit design.
Frequently Updated Research: Researchers in the field of semiconductor technology are constantly working on improving redistribution structures for better performance and reliability. Stay updated with the latest advancements in integrated circuit design and packaging techniques.
Questions about Redistribution Structures: 1. How does the mesh metal feature in the redistribution structure contribute to signal transmission efficiency? 2. What are the key differences between traditional redistribution structures and the one described in this patent application?
Original Abstract Submitted
a redistribution structure is provided. a redistribution structure according to the present disclosure includes a first dielectric layer, a mesh metal feature disposed in the first dielectric layer and including a base portion and a frame portion surrounding the base portion, a second dielectric layer disposed over the first dielectric layer and the mesh metal feature, a redistribution feature disposed over the second dielectric layer, a passivation structure disposed over the redistribution feature and the second dielectric layer, a pad opening extending through the passivation structure to expose a top surface of the redistribution feature. the redistribution feature includes a plurality of contact vias that extend through the second dielectric layer to land on the frame portion of the mesh metal feature.
