Taiwan semiconductor manufacturing co., ltd. (20240312910). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Wei-Kai Shih of Nantou County (TW)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240312910 titled 'SEMICONDUCTOR DEVICE
The abstract of the patent application describes a semiconductor device with a semiconductor substrate, a passivation layer, and a conductive pattern. The conductive pattern is electrically connected to a conductive pad on the substrate, with at least one turning point on the sidewall where it interfaces with the passivation layer and the pad.
- The semiconductor device includes a semiconductor substrate with a conductive pad, a passivation layer, and a conductive pattern.
- The conductive pattern penetrates through the passivation layer and is electrically connected to the conductive pad.
- The conductive pattern has at least one turning point on the sidewall where it meets the passivation layer and the conductive pad.
Potential Applications: - This technology can be used in various semiconductor devices such as integrated circuits, sensors, and microprocessors. - It can also be applied in electronic components for telecommunications, automotive systems, and consumer electronics.
Problems Solved: - Provides a reliable electrical connection between the conductive pad and the conductive pattern. - Enhances the performance and functionality of semiconductor devices by ensuring proper electrical connectivity.
Benefits: - Improved reliability and performance of semiconductor devices. - Enhanced electrical connectivity leading to better overall functionality. - Potential for increased efficiency and durability in electronic components.
Commercial Applications: Title: Advanced Semiconductor Devices for Enhanced Electrical Connectivity This technology can be utilized in the production of high-performance integrated circuits, sensors, and other electronic components. It has the potential to revolutionize the semiconductor industry by improving the reliability and functionality of various devices.
Questions about the technology: 1. How does the turning point on the sidewall of the conductive pattern impact the overall performance of the semiconductor device? 2. What are the specific advantages of using this technology in consumer electronics and automotive systems?
Original Abstract Submitted
one of the semiconductor devices includes a semiconductor substrate, a passivation layer and a conductive pattern. the semiconductor substrate includes a conductive pad thereover. the passivation layer over the semiconductor substrate. the conductive pattern is penetrating through the passivation layer and electrically connected to the conductive pad, wherein a sidewall of the conductive pattern interfacing with the passivation layer and the conductive pad has at least one turning point.
