Taiwan semiconductor manufacturing co., ltd. (20240312887). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Ming-Chih Yew of Hsinchu City (TW)
Shu-Shen Yeh of Taoyuan City (TW)
Po-Yao Lin of Hsinchu County (TW)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240312887 titled 'SEMICONDUCTOR PACKAGE
The manufacturing method of a semiconductor package involves forming a redistribution structure, providing an encapsulated semiconductor device on one side of the structure, and bonding a substrate to the other side.
- The encapsulated semiconductor device includes a semiconductor device encapsulated by a material.
- The redistribution structure has vias connected by conductive lines and a redistribution line with an angle greater than zero between adjacent conductive lines.
Potential Applications:
- This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices.
- It can improve the performance and reliability of semiconductor devices in applications such as consumer electronics, automotive systems, and industrial equipment.
Problems Solved:
- Enhances the structural integrity and electrical connectivity of semiconductor packages.
- Provides a more efficient and reliable method for packaging semiconductor devices.
Benefits:
- Improved performance and reliability of semiconductor devices.
- Enhanced structural integrity and electrical connectivity.
- Cost-effective manufacturing process for advanced semiconductor packages.
Commercial Applications:
- This technology can be utilized by semiconductor manufacturers, electronics companies, and technology firms to enhance the quality and performance of their products.
- It has the potential to drive innovation in the semiconductor packaging industry and meet the growing demand for high-performance electronic devices.
Prior Art:
- Researchers and engineers can explore prior art related to semiconductor packaging methods, redistribution structures, and encapsulation techniques to further enhance this technology.
Frequently Updated Research:
- Researchers are continually exploring new materials and processes to improve semiconductor packaging techniques and enhance the performance of electronic devices.
Questions about Semiconductor Packaging: 1. What are the key advantages of using a redistribution structure in semiconductor packaging? 2. How does the angle between adjacent conductive lines in the redistribution structure impact the performance of the semiconductor package?
Original Abstract Submitted
a manufacturing method of a semiconductor package includes the following steps. a redistribution structure is formed. an encapsulated semiconductor device is provided on a first side of the redistribution structure, wherein the encapsulated semiconductor device comprising a semiconductor device encapsulated by an encapsulating material. a substrate is bonded to a second side of the redistribution structure opposite to the first side. the redistribution structure includes a plurality of vias connected to one another through a plurality of conductive lines and a redistribution line connected to the plurality of vias, and, from a top view, an angle greater than zero is included between adjacent two of the plurality of conductive lines.
