Taiwan semiconductor manufacturing co., ltd. (20240250020). VIA FOR SEMICONDUCTOR DEVICE CONNECTION simplified abstract

VIA FOR SEMICONDUCTOR DEVICE CONNECTION

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Chen-Hua Yu of Hsinchu (TW)

An-Jhih Su of Taoyuan City (TW)

Chi-Hsi Wu of Hsinchu (TW)

Wen-Chih Chiou of Zhunan Township (TW)

Tsang-Jiuh Wu of Hsinchu (TW)

Der-Chyang Yeh of Hsinchu (TW)

Ming Shih Yeh of Zhubei City (TW)

VIA FOR SEMICONDUCTOR DEVICE CONNECTION - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240250020 titled 'VIA FOR SEMICONDUCTOR DEVICE CONNECTION

Simplified Explanation: The patent application describes a method for forming a via in a semiconductor device, involving bonding terminals of substrates, separating the substrates, filling a gap with material, and creating a conductive via to connect components.

Key Features and Innovation:

• Method for forming a via in a semiconductor device
• Bonding terminals of substrates
• Separating substrates to create component devices
• Filling a gap with material
• Creating a conductive via to connect components

Potential Applications: This technology can be applied in the semiconductor industry for the fabrication of advanced electronic devices, integrated circuits, and microprocessors.

Problems Solved: This technology addresses the need for efficient and reliable methods of forming vias in semiconductor devices to ensure proper connectivity between components.

Benefits:

• Improved connectivity in semiconductor devices
• Enhanced performance of electronic components
• Increased reliability of integrated circuits

Commercial Applications: The technology can be utilized in the production of high-performance electronic devices, leading to advancements in telecommunications, computing, and consumer electronics markets.

Prior Art: Prior art related to this technology can be found in patents and research papers focusing on semiconductor device fabrication and interconnect technologies.

Frequently Updated Research: Ongoing research in the semiconductor industry continues to explore new materials and methods for enhancing the performance and efficiency of semiconductor devices.

Questions about Semiconductor Device Via Formation: 1. How does the method of forming a via in a semiconductor device improve connectivity between components? 2. What are the potential challenges in implementing this technology on a large scale in semiconductor manufacturing processes?

Original Abstract Submitted

a method for forming a via in a semiconductor device and a semiconductor device including the via are disclosed. in an embodiment, the method may include bonding a first terminal and a second terminal of a first substrate to a third terminal and a fourth terminal of a second substrate; separating the first substrate to form a first component device and a second component device; forming a gap fill material over the first component device, the second component device, and the second substrate; forming a conductive via extending from a top surface of the gap fill material to a fifth terminal of the second substrate; and forming a top terminal over a top surface of the first component device, the top terminal connecting the first component device to the fifth terminal of the second substrate through the conductive via.