Taiwan semiconductor manufacturing co., ltd. (20240222363). SEMICONDUCTOR DEVICE HAVING MULTIPLE ELECTROSTATIC DISCHARGE (ESD) PATHS simplified abstract
Contents
SEMICONDUCTOR DEVICE HAVING MULTIPLE ELECTROSTATIC DISCHARGE (ESD) PATHS
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Po-Lin Peng of Taoyuan City (TW)
Li-Wei Chu of Hsinchu City (TW)
Ming-Fu Tsai of Hsinchu City (TW)
Jam-Wem Lee of Hsinchu City (TW)
SEMICONDUCTOR DEVICE HAVING MULTIPLE ELECTROSTATIC DISCHARGE (ESD) PATHS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222363 titled 'SEMICONDUCTOR DEVICE HAVING MULTIPLE ELECTROSTATIC DISCHARGE (ESD) PATHS
The semiconductor device described in the abstract consists of multiple diodes and a clamp circuit to protect against electrostatic discharge (ESD) events.
- The first diode is connected between an input/output pad and a voltage terminal.
- The second diode is linked with the first diode, the input/output pad, and another voltage terminal.
- The clamp circuit is positioned between the two voltage terminals to manage ESD currents.
- The third diode, connected to the first voltage terminal, works with the second diode to divert ESD currents away from sensitive components.
Potential Applications: - This technology can be used in various electronic devices to safeguard against ESD damage. - It can be implemented in integrated circuits, microcontrollers, and other semiconductor devices.
Problems Solved: - Protects sensitive electronic components from damage due to ESD events. - Ensures the reliability and longevity of semiconductor devices in different applications.
Benefits: - Enhanced protection against ESD events. - Improved reliability and durability of electronic devices. - Cost-effective solution for ESD protection in semiconductor devices.
Commercial Applications: Title: "ESD Protection Technology for Semiconductor Devices" This technology can be utilized in the manufacturing of consumer electronics, automotive electronics, industrial control systems, and telecommunications equipment to enhance product reliability and longevity.
Questions about ESD Protection Technology for Semiconductor Devices: 1. How does this technology compare to traditional ESD protection methods?
- This technology offers more efficient and reliable protection against ESD events compared to traditional methods by utilizing multiple diodes and a clamp circuit.
2. What are the key considerations for implementing this technology in different electronic devices?
- The key considerations include the specific requirements of the device, the level of ESD protection needed, and the integration of the technology into the existing circuit design.
Original Abstract Submitted
a semiconductor device includes a first diode, a second diode, a clamp circuit and a third diode. the first diode is coupled between an input/output (i/o) pad and a first voltage terminal. the second diode is coupled with the first diode, the i/o pad and a second voltage terminal. the clamp circuit is coupled between the first voltage terminal and the second voltage terminal. the second diode and the clamp circuit are configured to direct a first part of an electrostatic discharge (esd) current flowing between the i/o pad and the first voltage terminal. the third diode, coupled to the first voltage terminal, and the second diode include a first semiconductor structure configured to direct a second part of the esd current flowing between the i/o pad and the first voltage terminal.
